Scattering of SH waves in a bi-material half space with a circular hole and periodic type III interfacial cracks

被引：5
|
作者：
Yang, Jie [1 ]
Liu, Shen [1 ]
Yang, Bin [2 ]
Liu, Yue [1 ]
机构：
[1] Shanghai Dianji Univ, Sch Mech Engn, Shanghai 201306, Peoples R China
[2] Tongji Univ, Sch Aerosp Engn & Appl Mech, Shanghai, Peoples R China
来源：
MECHANICS OF ADVANCED MATERIALS AND STRUCTURES | 2023年 / 30卷 / 14期
基金：
中国国家自然科学基金;
关键词：
SH waves; circular hole; periodic cracks; dynamic stress concentration factor (DSCF); complex function; DYNAMIC STRESS-CONCENTRATIONS; LOVE-TYPE WAVE; ALLUVIAL VALLEY; THICK PLATES; PROPAGATION; CAVITY; LAYER;
D O I：
10.1080/15376494.2022.2064568
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The dynamic anti-plane response of a bi-material half space including a circular hole and periodic interfacial cracks is investigated. An analytical model is established for periodic type III cracks that adopt the idea of "conjunction" modeling. The definite integral equations suitable for modeling the existence of multiple interfacial cracks are derived that satisfy the continuity conditions at the interface. Numerical calculations are carried out to find the dynamic stress concentration factor (DSCF), whose results indicate that the number of interfacial cracks has a significant effect on the dynamic stress concentration around the hole edge, especially for low-frequency incident SH waves.
引用
收藏
页码：2863 / 2871
页数：9
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