Structure and Heat Transfer Characteristic Evolution of CaO-SiO2-CaF2-Based Solid Mold Flux Film upon Solidification

In this study, two typical commercially used CaO-SiO2-CaF2-based mold fluxes with different basicities were adopted. Solid slag films of the two mold fluxes were obtained by immersing an improved water-cooled copper probe in the molten fluxes for different probe immersion times and molten slag temperatures. The film thickness, closed porosity, and roughness of the film surfaces in contact with the copper probe were measured. The heat flux through the solidified films and the comprehensive thermal conductivity of the films were both calculated. The results indicated that compared with the heat flux through high-basicity films, the heat flux through low-basicity films exhibited high fluctuation due to the evolution of fusion cracks within the glass layer. High-basicity mold fluxes resulted in higher thickness, growth velocity, surface roughness, and devitrification velocity of the films. With the growth and crystallization of the slag films, the comprehensive thermal conductivity of the high-basicity films increased significantly. For the low-basicity films, their comprehensive thermal conductivity first decreased and then increased after the solidification time exceeded 30 s. The comprehensive thermal conductivity of the high- and low-basicity films ranged from 0.63 to 0.91 and 0.62 to 0.81 W/(m center dot K), respectively. The results provide a novel method for analyzing the potential effect of the structural factors of slag films on heat transfer control and controlling the heat transfer behavior of slag films.