Despite the broadly applicable potential in the bioelectronics, organic/inorganic material-based bioelectronics have some limitations such as hard stiffness and low biocompatibility. To overcome these limitations, hydrogels capable of bridging the interface and connecting biological materials and electronics have been investigated for development of hydrogel bioelectronics. Although hydrogel bioelectronics have shown unique properties including flexibility and biocompatibility, there are still limitations in developing novel hydrogel bioelectronics using only hydrogels such as their low electrical conductivity and structural stability. As an alternative solution to address these issues, studies on the development of biohybrid hydrogels that incorporating nanomaterials into the hydrogels have been conducted for bioelectronic applications. Nanomaterials complement the shortcomings of hydrogels for bioelectronic applications, and provide new functionality in biohybrid hydrogel bioelectronics. In this review, we provide the recent studies on biohybrid hydrogels and their bioelectronic applications. Firstly, representative nanomaterials and hydrogels constituting biohybrid hydrogels are provided, and next, applications of biohybrid hydrogels in bioelectronics categorized in flexible/wearable bioelectronic devices, tissue engineering, and biorobotics are discussed with recent studies. In conclusion, we strongly believe that this review provides the latest knowledge and strategies on hydrogel bioelectronics through the combination of nanomaterials and hydrogels, and direction of future hydrogel bioelectronics.
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Univ Calif Los Angeles, Dept Med, Div NanoMed, Los Angeles, CA 90095 USA
Univ Calif Los Angeles, CEIN, Calif NanoSyst Inst CNSI, Los Angeles, CA 90095 USA
Dalian Univ Technol, Sch Chem Engn, 2 Linggong Rd, Dalian 116024, Peoples R ChinaUniv Calif Los Angeles, Dept Med, Div NanoMed, Los Angeles, CA 90095 USA
Sun, Bingbing
Xia, Tian
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机构:
Univ Calif Los Angeles, Dept Med, Div NanoMed, Los Angeles, CA 90095 USA
Univ Calif Los Angeles, CEIN, Calif NanoSyst Inst CNSI, Los Angeles, CA 90095 USAUniv Calif Los Angeles, Dept Med, Div NanoMed, Los Angeles, CA 90095 USA
机构:
Univ Penn, Dept Radiol, Philadelphia, PA 19104 USA
Univ Wisconsin Madison, Dept Radiol, Madison, WI USA
Univ Wisconsin Madison, Dept Med Phys, Madison, WI USAUniv Penn, Dept Radiol, Philadelphia, PA 19104 USA
Hsu, Jessica C. C.
Tang, Zhongmin
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Univ Wisconsin Madison, Dept Radiol, Madison, WI USA
Univ Wisconsin Madison, Dept Med Phys, Madison, WI USAUniv Penn, Dept Radiol, Philadelphia, PA 19104 USA
Tang, Zhongmin
Eremina, Olga E.
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Univ Southern Calif, Dept Biomed Engn, Los Angeles, CA USAUniv Penn, Dept Radiol, Philadelphia, PA 19104 USA
Eremina, Olga E.
Sofias, Alexandros Marios
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Rhein Westfal TH Aachen, Inst Expt Mol Imaging, Fac Med, Dept Nanomed & Theranost, Aachen, GermanyUniv Penn, Dept Radiol, Philadelphia, PA 19104 USA
Sofias, Alexandros Marios
Lammers, Twan
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机构:
Rhein Westfal TH Aachen, Inst Expt Mol Imaging, Fac Med, Dept Nanomed & Theranost, Aachen, GermanyUniv Penn, Dept Radiol, Philadelphia, PA 19104 USA
Lammers, Twan
Lovell, Jonathan F.
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SUNY Buffalo, Dept Biomed Engn, Buffalo, NY USAUniv Penn, Dept Radiol, Philadelphia, PA 19104 USA
Lovell, Jonathan F.
Zavaleta, Cristina
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Univ Southern Calif, Dept Biomed Engn, Los Angeles, CA USAUniv Penn, Dept Radiol, Philadelphia, PA 19104 USA
Zavaleta, Cristina
Cai, Weibo
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Univ Wisconsin Madison, Dept Radiol, Madison, WI USA
Univ Wisconsin Madison, Dept Med Phys, Madison, WI USAUniv Penn, Dept Radiol, Philadelphia, PA 19104 USA
Cai, Weibo
Cormode, David P.
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Univ Penn, Dept Radiol, Philadelphia, PA 19104 USAUniv Penn, Dept Radiol, Philadelphia, PA 19104 USA
机构:
East China Univ Sci & Technol, Sch Mech & Power Engn, Shanghai 200030, Peoples R ChinaEast China Univ Sci & Technol, Sch Mech & Power Engn, Shanghai 200030, Peoples R China