共 50 条
- [1] PRESSURIZED THERMAL SHOCK ANALYSIS WITH SUB-MODELING [J]. PROCEEDINGS OF ASME 2021 PRESSURE VESSELS AND PIPING CONFERENCE (PVP2021), VOL 3, 2021,
- [2] Thermal sub-modeling of high density interconnect substrates [J]. ITHERM 2002: EIGHTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, PROCEEDINGS, 2002, : 618 - 625
- [3] NOISE LEVEL LIMITED SUB-MODELING FOR DIFFUSION PROBABILISTIC VOCODERS [J]. 2021 IEEE INTERNATIONAL CONFERENCE ON ACOUSTICS, SPEECH AND SIGNAL PROCESSING (ICASSP 2021), 2021, : 6029 - 6033
- [4] Application of Finite Element Sub-Modeling Techniques in Structural Mechanics [J]. MECHANIKA, 2021, 27 (06): : 459 - 464
- [5] APPLICATION OF FINITE ELEMENT SUB-MODELING TECHNIQUES IN STRUCTURAL MECHANICS [J]. Mechanika, 2021, 27 (06): : 459 - 464
- [6] Thermal sub-modeling of the wirebonded plastic ball grid array package [J]. THIRTEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 1997, 1997, : 1 - 9
- [7] Solder Crack Simulation using SPH Particle Method with Sub-modeling Technique [J]. 2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), 2014, : 502 - 506