Coaxial Electrohydrodynamic Printing of Microscale Core-Shell Conductive Features for Integrated Fabrication of Flexible Transparent Electronics

被引:4
|
作者
Yu, Kun [1 ,2 ]
Qiu, Zhennan [1 ,2 ]
Gu, Bingsong [1 ,2 ]
Li, Jiaxin [1 ,2 ]
Meng, Zijie [1 ,2 ]
Li, Dichen [1 ,2 ]
He, Jiankang [1 ,2 ]
机构
[1] Xi An Jiao Tong Univ, State Key Lab Mfg Syst Engn, Xian 710049, Shaanxi, Peoples R China
[2] Xi An Jiao Tong Univ, NMPA Key Lab Res & Evaluat Addit Mfg Med Devices, Xian 710049, Shaanxi, Peoples R China
基金
中国国家自然科学基金;
关键词
coaxial electrohydrodynamic printing; microscaleconductivestructures; core-shell filament; flexibletransparent electronics; JET;
D O I
10.1021/acsami.3c15237
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Reliable insulation of microscale conductive features is required to fabricate functional multilayer circuits or flexible electronics for providing specific physical/chemical/electrical protection. However, the existing strategies commonly rely on manual assembling processes or multiple microfabrication processes, which is time-consuming and a great challenge for the fabrication of flexible transparent electronics with microscale features and ultrathin thickness. Here, we present a novel coaxial electrohydrodynamic (CEHD) printing strategy for the one-step fabrication of microscale flexible electronics with conductive materials at the core and insulating material at the outer layer. A finite element analysis (FEA) method is established to simulate the CEHD printing process. The extrusion sequence of the conductive and insulating materials during the CEHD printing process shows little effect on the morphology of the core-shell filaments, which can be achieved on different flexible substrates with a minimum conductive line width of 32 +/- 3.2 mu m, a total thickness of 53.6 +/- 4.8 mu m, and a conductivity of 0.23 x 10(7) S/m. The thin insulating layer can provide the inner conductive filament enough protection in 3D, which endows the resultant microscale core-shell electronics with good electrical stability when working in different chemical solvent solutions or under large deformation conditions. Moreover, the presented CEHD printing strategy offers a unique capability to sequentially fabricate an insulating layer, core-shell conductive pattern, and exposed electrodes by simply controlling the material extrusion sequence. The resultant large-area transparent electronics with two-layer core-shell patterns exhibit a high transmittance of 98% and excellent electrothermal performance. The CEHD-printed flexible microelectrode array is successfully used to record the electrical signals of beating mouse hearts. It can also be used to fabricate large-area flexible capacitive sensors to accurately measure the periodical pressure force. We envision that the present CEHD printing strategy can provide a promising tool to fabricate complex three-dimensional electronics with microscale resolution, high flexibility, and multiple functionalities.
引用
收藏
页码:1114 / 1128
页数:15
相关论文
共 50 条
  • [31] AgNWs-a-TiOx: a scalable wire bar coated core-shell nanocomposite as transparent thin film electrode for flexible electronics applications
    Arulkumar, S.
    Senthilkumar, T.
    Parthiban, S.
    Dharmalingam, Gnanaprakash
    Goswami, Anandarup
    Alshehri, Saad M.
    Gawande, Manoj B.
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 32 (05) : 6454 - 6464
  • [32] Coaxial electrohydrodynamic printing of core–shell microfibrous scaffolds with layer-specific growth factors release for enthesis regeneration
    Lang Bai
    Meiguang Xu
    Zijie Meng
    Zhennan Qiu
    Jintao Xiu
    Baojun Chen
    Qian Han
    Qiaonan Liu
    Pei He
    Nuanyang Wen
    Jiankang He
    Jing Zhang
    Zhanhai Yin
    International Journal of Extreme Manufacturing, 2024, 6 (05) : 234 - 253
  • [33] Fabrication of conductive interconnects by Ag migration in Cu-Ag core-shell nanoparticles
    Kim, Suk Jun
    Stach, Eric A.
    Handwerker, Carol A.
    APPLIED PHYSICS LETTERS, 2010, 96 (14)
  • [34] Flexible Transparent Conductive Films of Ag/Cr2O3 Core-Shell Nanowires as Electrodes for Electroluminescent Devices and Heaters
    Jia, Xiuhuai
    Zhao, Le
    Yang, Pan
    An, Wenxing
    Wang, Zilan
    Yu, Shihui
    ACS APPLIED NANO MATERIALS, 2023, 6 (17) : 16024 - 16033
  • [35] Au@MnO2 Core-Shell Nanomesh Electrodes for Transparent Flexible Supercapacitors
    Qiu, Tengfei
    Luo, Bin
    Giersig, Michael
    Akinoglu, Eser Metin
    Hao, Long
    Wang, Xiangjun
    Shi, Lin
    Jin, Meihua
    Zhi, Linjie
    SMALL, 2014, 10 (20) : 4136 - 4141
  • [36] Synthesis of Ag-Ni core-shell nanowires and their application in anisotropic transparent conductive films
    Liu, Bo-Tau
    Huang, Shao-Xian
    Lai, Mei-Feng
    Wei, Zung-Hang
    RSC ADVANCES, 2015, 5 (03): : 1684 - 1689
  • [37] Fabrication and Properties of Core-Shell Structure P(LLA-CL) Nanofibers by Coaxial Electrospinning
    Li Xiaoqiang
    Su Yan
    Chen Rui
    He Chuanglong
    Wang Hongsheng
    Mo Xiumei
    JOURNAL OF APPLIED POLYMER SCIENCE, 2009, 111 (03) : 1564 - 1570
  • [38] Fabrication of Core-Shell Collagen/HAP Fibers via Coaxial Electrospinning Using Nontoxic Solvent
    Zhou Yuanyuan
    Li Song
    Yuan Bo
    Men Bo
    Ren Mengyuan
    SCIENCE OF ADVANCED MATERIALS, 2018, 10 (01) : 18 - 23
  • [39] Direct Fabrication of VIA Interconnects by Electrohydrodynamic Printing for Multi-Layer 3D Flexible and Stretchable Electronics
    Ren, Ping
    Dong, Jingyan
    ADVANCED MATERIALS TECHNOLOGIES, 2021, 6 (09)
  • [40] A bimodal core-shell structured Cu-Ag nanoparticles based conductive ink capable of low temperature sintering for printed flexible electronics
    Huang, Hai-Jun
    Wu, Xue
    Ma, Xiao
    Zhou, Min-Bo
    Zhang, Xin-Ping
    ICEPT2019: THE 2019 20TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2019,