A DIGITAL PCR CHIP WITH 3D STRUCTURE AND COMPOSITE MATERIALS

被引:0
|
作者
Gao, Shiyuan [1 ,2 ,3 ]
Xu, Tiegang [1 ,2 ]
Wu, Lei [1 ,2 ]
Zhu, Xiaoyue [4 ]
Ma, Zhan [5 ]
Li, Xinxin [1 ,2 ,3 ]
机构
[1] Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Transducer Technol, Shanghai 200050, Peoples R China
[2] Univ Chinese Acad Sci, Coll Mat Sci & Opto Elect Technol, Beijing 100049, Peoples R China
[3] ShanghaiTech Univ, Sch Informat Sci & Technol, Shanghai 201210, Peoples R China
[4] Fujian Agr & Forestry Univ, Haixia Inst Sci & Technol, Sch Future Technol, Metabol Ctr, Fuzhou 350002, Fujian, Peoples R China
[5] Shanghai Jiao Tong Univ, Shanghai Childrens Hosp, Fac Med Lab Sci, Sch Med, Shanghai 200062, Peoples R China
基金
国家重点研发计划; 中国国家自然科学基金;
关键词
Digital PCR; silicon; three-dimensional; high-density; fluorescent light reflection;
D O I
10.1109/MEMS58180.2024.10439396
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We designed and fabricated a three-dimensional (3D) digital PCR (dPCR) chip for better sample compartmentalization and stronger fluorescent signals. The chip was made of glass, silicon and poly dimethylsiloxane (PDMS) layers, respectively. All the microstructures were fabricated on the silicon substrate, with high-density hexagonal-shape reaction units regularly arranged in the reaction zone. A common fed channel was located underneath the reaction units to maximize the use of the chip area. The reaction units and the flow channel were connected by cylindrical micro-holes, which made the oil-water two-phase system more stable and reduced the interference of fluorescence signals due to residual sample in the flow channel. In addition, fluorescent light reflection on the silicon surface enhanced the resolution of dPCR image.
引用
收藏
页码:665 / 668
页数:4
相关论文
共 50 条
  • [31] On-chip inductance models: 3D or not 3D?
    Lin, T
    Beattie, MW
    Pileggi, LT
    DESIGN, AUTOMATION AND TEST IN EUROPE CONFERENCE AND EXHIBITION, 2002 PROCEEDINGS, 2002, : 1112 - 1112
  • [32] A Comparative Study of 2D and 3D Digital Image Correlation Approaches for the Characterization and Numerical Analysis of Composite Materials
    Pisonero, Javier
    Lopez-Rebollo, Jorge
    Garcia-Martin, Roberto
    Rodriguez-Martin, Manuel
    Javier Sanchez-Aparicio, Luis
    Munoz-Nieto, A.
    Gonzalez-Aguilera, Diego
    IEEE ACCESS, 2021, 9 : 160675 - 160687
  • [33] Functionalized 3D graphene structure as biointerfacing materials
    Luo, Zhengtang
    Zhuang, Minghao
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2016, 252
  • [34] Coming "3D" for digital camera: Development of 3d digital camera
    Tsurukawa M.
    Tanaka K.
    Shikata D.
    Kyokai Joho Imeji Zasshi/Journal of the Institute of Image Information and Television Engineers, 2011, 65 (03): : 286 - 289
  • [35] The detection of circulating tumor DNA using Quantstudio 3D digital PCR
    Greer, Adam H.
    Mills, Glenn
    Yin, Hong
    CANCER RESEARCH, 2015, 75
  • [36] TaqMan® rare mutation assays for QuantStudio® 3D digital PCR system
    Laig, Marion
    Ho, Brian
    Majumdar, Nivedita S.
    Lac, Le T.
    Chan, Frances
    Sathiyaa, Ramesh
    Russel, Iain
    Cifuentes, Paco
    Straub, Ted
    Varma, Kamini
    Keys, David
    CANCER RESEARCH, 2015, 75
  • [37] Materials, processing and reliability of low temperature bonding in 3D chip stacking
    Zhang, Liang
    Liu, Zhi-quan
    Chen, Sinn-Wen
    Wang, Yao-dong
    Long, Wei-Min
    Guo, Yong-huan
    Wang, Song-quan
    Ye, Guo
    Liu, Wen-yi
    JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 750 : 980 - 995
  • [38] Exploring the Composite Intentionality of 3D Printers and Makers in Digital Fabrication
    Somanath, Sowmya
    Wakkary, Ron
    Ettehadi, Omid
    Lin, Henry
    Behzad, Armi
    Eshpeter, Jordan
    Oogjes, Doenja
    INTERNATIONAL JOURNAL OF DESIGN, 2022, 16 (03): : 77 - 95
  • [39] 3D Integration Technology for 3D Stacked Retinal Chip
    Kaiho, Y.
    Ohara, Y.
    Takeshita, H.
    Kiyoyama, K.
    Lee, K-W
    Tanaka, T.
    Koyanagi, M.
    2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION, 2009, : 211 - +
  • [40] Decomposing digital 3D shapes using a multiresolution structure
    Borgefors, G
    di Baja, GS
    Svensson, S
    DISCRETE GEOMETRY FOR COMPUTER IMAGERY, 1999, 1568 : 19 - 30