ON THE EFFECT OF OXYGEN ON PLASMA CHEMICAL KINETICS IN CF4

被引:0
|
作者
Efremov, A. M. [1 ]
Bashmakova, D. E. [1 ]
Kwon, K. -H. [2 ]
机构
[1] Ivanovo State Univ Chem & Technol, Sheremetevskiy Ave 7, Ivanovo 153000, Russia
[2] Korea Univ, 208 Seochang Dong, Chochiwon 339800, South Korea
关键词
CF4; C4F8; O-2; plasma; parameters; active species; ionization; dissociation; etching; polymerization; ACTIVE SPECIES KINETICS; SILICON-NITRIDE; PARAMETERS; MODEL; MECHANISM;
D O I
10.6060/ivkkt.20246701.6721
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
In this work, we performed the comparative study of electro-physical plasma parameters, densities of active species and fluorine atom kinetics in CF4 + O-2 and C4F8 + O-2 gas mixtures with variable initial compositions at constant gas pressure and input power. The combination of plasma diagnostics by Langmuir probes and plasma modeling confirmed known features of plasma properties in individual fluorocarbon gases as well as allowed one to figure out key chemical processes determining plasma parameters in the presence of oxygen. It was shown that an increase in O-2 content with a proportional decrease in the fraction of any fluorocarbon component a) causes relatively weak changes in electrons-and ions-related plasma parameters; b) results in more drastic (compared with the dilution effect) decrease in densities of fluorocarbon radicals due to their oxidation into CFxO, FO and COx compounds; and c) sufficiently influences both formation and decay kinetics of fluorine atoms. The non-monotonic (with a maximum at similar to 40-50% O-2) change in the F atom density in the CF4 + O-2 plasma repeats behavior of their formation rate after the contribution of processes involving CFxO u FO species. The monotonic increase (with a constancy region up to similar to 40-50% O-2) in the F atom density in the C4F8 + O-2 plasma contradicts with the change in their formation rate, but results from decreasing decay frequency in gas-phase atom-molecular processes. The predictive analysis of heterogeneous process kinetics was carried out using model yielded data on fluxes of plasma active species. It was found that a) the addition of oxygen always lowers the plasma polymerizing ability; and b) the C4F8 + O-2 plasma keeps the higher polymerizing ability at any feed gas composition.
引用
收藏
页码:51 / 59
页数:9
相关论文
共 50 条
  • [1] PLASMA PARAMETRS AND SILICON ETCHING KINETICS IN CF4
    Efremov, A. M.
    Bobylev, A. V.
    IZVESTIYA VYSSHIKH UCHEBNYKH ZAVEDENII KHIMIYA I KHIMICHESKAYA TEKHNOLOGIYA, 2024, 67 (06): : 29 - 37
  • [2] Kinetics of etching of silicon dioxide in a CF4 plasma
    Kim, MT
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2000, 147 (03) : 1204 - 1209
  • [3] Radical kinetics in an inductively-coupled plasma in CF4
    Booth, JP
    Abada, H
    Chabert, P
    Graves, DB
    PHYSICS OF IONIZED GASES, 2004, 740 : 252 - 267
  • [4] Effect of nonthermal plasma reactor for CF4 decomposition
    Park, JY
    Jung, JG
    Kim, JS
    Rim, GH
    Kim, KS
    IEEE TRANSACTIONS ON PLASMA SCIENCE, 2003, 31 (06) : 1349 - 1354
  • [5] On the Role of Radicals in Kinetics of Plasma Etchers in Ar/CF4 Mixtures
    Nikitovic, Z.
    Stojanovic, V.
    Petrovic, Z. Lj.
    ACTA PHYSICA POLONICA A, 2009, 115 (04) : 765 - 767
  • [6] On the role of radicals in kinetics of plasma etchers in Ar/CF4 mixtures
    Institute of Physics, Pregrevica 118, 11080 Belgrade, Serbia
    Acta Phys Pol A, 2009, 4 (765-767):
  • [7] PLASMA ETCHING OF SI AND SIO2 - EFFECT OF OXYGEN ADDITIONS TO CF4 PLASMAS
    MOGAB, CJ
    ADAMS, AC
    FLAMM, DL
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1978, 15 (02): : 333 - 333
  • [8] PLASMA ETCHING OF SI AND SIO2 - EFFECT OF OXYGEN ADDITIONS TO CF4 PLASMAS
    MOGAB, CJ
    ADAMS, AC
    FLAMM, DL
    JOURNAL OF APPLIED PHYSICS, 1978, 49 (07) : 3796 - 3803
  • [9] Effect of CF4 plasma pretreatment on low temperature oxides
    Chang, TY
    Chen, HW
    Lei, TF
    Chao, TS
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2002, 49 (12) : 2163 - 2170
  • [10] PHOTODETACHMENT EFFECT IN A RADIO-FREQUENCY PLASMA IN CF4
    JAUBERTEAU, JL
    MEEUSEN, GJ
    HAVERLAG, M
    KROESEN, GMW
    DEHOOG, FJ
    APPLIED PHYSICS LETTERS, 1989, 55 (25) : 2597 - 2599