Guest Editorial Special Section on Advances in Modeling and Characterization for Electronics Cooling

被引：0
|
作者：
Persoons, Tim [1 ]
Codecasa, Lorenzo [2 ]
机构：
[1] Trinity Coll Dublin, Dept Mech Mfg & Biomed Engn, Dublin, Ireland
[2] Politecn Milan, Elect Engn, Milan, Italy
来源：
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2023年 / 13卷 / 08期
关键词：
Special issues and sections; Thermal management; Electronic equipment; Cooling; Modeling; Power system dynamics; Density measurement;
D O I：
10.1109/TCPMT.2023.3308669
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：1085 / 1087
页数：3
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