Effect of AlN and AlGaN Interlayers on AlScN/GaN Heterostructures Grown by Metal-Organic Chemical Vapor Deposition

AlScN/GaN heterostructures with their high sheet carrier density (ns) in the two-dimensional electron gas (2DEG) have a high potential for high-frequency and high-power electronics. The abruptness of the heterointerface plays a key role in the 2DEG confinement, and the presence of interlayers (AlN, AlGaN) affects ns and electron mobility (mu) and determines the sheet resistance (Rsh). AlScN/GaN heterostructures suitable for high-electron mobility transistors (HEMT) with and without a nominal AlN interlayer were grown by metal-organic chemical vapor deposition (MOCVD) and characterized electrically and structurally to gain a systematic insight into the unintentional formation and control of graded AlGaN interlayers by diffusion of atoms at the heterointerface. The AlN interlayer increases ns from 2.52 x 1013 cm-2 to 3.25 x 1013 cm-2 and, as calculated by one-dimensional Schro''dinger-Poisson simulations, improves the 2DEG confinement. The barrier growth temperature was varied from 900 degrees C to 1200 degrees C to investigate the effect of the thermal budget on diffusion. Growth at 900 degrees C reduces the thickness of the graded AlGaN interlayer and improves the 2DEG confinement, leading to Rsh of 211 omega/sq, ns of 2.98 x 1013 cm-2, and mu of 998 cm2/(Vs).