ON-MEMS-CHIP COMPACT TEMPERATURE SENSOR FOR LARGE-VOLUME, LOW-COST SENSOR CALIBRATION

被引：2

作者：

Frigerio, Paolo ^{[1
]}

Fagnani, Andrea ^{[1
]}

Zega, Valentina ^{[1
]}

Gattere, Gabriele ^{[2
]}

Frangi, Attilio ^{[1
]}

Langfelder, Giacomo ^{[1
]}

机构：

[1] Politecn Milan, Milan, Italy

[2] STMicroelect, Cornaredo, Italy

来源：

2023 IEEE 36TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, MEMS | 2023年

关键词：

MEMS; multi-mode resonators; temperature sensors; temperature coefficient of frequency;

D O I：

10.1109/MEMS49605.2023.10052513

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The work introduces a MEMS temperature sensor for use in the same module of other sensors, to provide optimal measurements for their thermal calibration/compensation purposes. The sensor, made of 25-mu m-thick, lowly-doped, epitaxial polysilicon, relies on a multi-mode resonator, where the frequency ratio is used to extract relative temperature changes without the need of an external absolute time reference. Measurements across the [5-85]degrees C range validate the predictions of the frequency behavior, enabling to estimate +/- 50 mK(rms) resolution at 4-Hz data rate.

引用

页码：989 / 992

页数：4

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