Advanced Packaging Goes to Market

被引：0

作者：

Patti, Robert ^{[1
]}

Ai, FaBrick ^{[1
]}

机构：

[1] Nhanced Semicond Inc, Batavia, IL 60510 USA

来源：

关键词：

D O I：

暂无

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

引用

页数：1

共 50 条

[41] Market outlook: Packaging
Lifshitz, Ian
Pulp and Paper Canada, 2019, 120 (01):
[42] The global packaging market
Reardon, Corey M.
Paper, Film and Foil Converter, 2003, 77 (02):
[43] PACKAGING MARKET IN DEVELOPMENT
WAERNBUG.P
SVENSK PAPPERSTIDNING-NORDISK CELLULOSA, 1971, 74 (23): : 817 - &
[44] Packaging market turmoil
Woods, Tim
APPITA, 2014, 67 (02): : 82 - 83
[45] PACKAGING AND MARKET DESIGN
LEONARD, M
JOURNAL OF THE SOCIETY OF DAIRY TECHNOLOGY, 1985, 38 (03): : 76 - 77
[46] Packaging Corp. goes public with IPO
Anon
Pulp and Paper Week, 2000, 22 (04):
[47] Packaging market turmoil
Woods, Tim
Appita Journal, 2014, 67 (02): : 82 - 83
[48] Innovations in the food packaging market: active packaging
Joanna Wyrwa
Anetta Barska
European Food Research and Technology, 2017, 243 : 1681 - 1692
[49] Innovations in the food packaging market: active packaging
Wyrwa, Joanna
Barska, Anetta
EUROPEAN FOOD RESEARCH AND TECHNOLOGY, 2017, 243 (10) : 1681 - 1692
[50] GOES advanced sounder design
Bicknell, WE
Kerekes, JP
RyanHoward, DP
GOES-8 AND BEYOND, 1996, 2812 : 409 - 425