Scalable manufacturing of quantum light emitters in silicon under rapid thermal annealing

被引:13
|
作者
Zhiyenbayev, Yertay [1 ]
Redjem, Walid [1 ]
Ivanov, Vsevolod [2 ,3 ]
Qarony, Wayesh [1 ]
Papapanos, Christos [1 ]
Simoni, Jacopo [2 ]
Liu, Wei [3 ]
Jhuria, Kaushalya [3 ]
Tan, Liang Z. [2 ]
Schenkel, Thomas [3 ]
Kante, Boubacar [1 ,4 ]
机构
[1] Univ Calif Berkeley, Dept Elect Engn & Comp Sci, Berkeley, CA 94720 USA
[2] Lawrence Berkeley Natl Lab, Mol Foundry, Berkeley, CA 94720 USA
[3] Lawrence Berkeley Natl Lab, Accelerator Technol & Appl Phys Div, Berkeley, CA 94720 USA
[4] Lawrence Berkeley Natl Lab, Mat Sci Div, Berkeley, CA 94720 USA
基金
美国国家科学基金会;
关键词
TOTAL-ENERGY CALCULATIONS; RECOMBINATION LUMINESCENCE; INTERSTITIAL-CARBON; GERMANIUM; PHOTOLUMINESCENCE; EMISSION; CENTERS;
D O I
10.1364/OE.482311
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
Quantum light sources play a fundamental role in quantum technologies ranging from quantum networking to quantum sensing and computation. The development of these technologies requires scalable platforms, and the recent discovery of quantum light sources in silicon represents an exciting and promising prospect for scalability. The usual process for creating color centers in silicon involves carbon implantation into silicon, followed by rapid thermal annealing. However, the dependence of critical optical properties, such as the inhomogeneous broadening, the density, and the signal-to-background ratio, on centers implantation steps is poorly understood. We investigate the role of rapid thermal annealing on the dynamic of the formation of single color centers in silicon. We find that the density and the inhomogeneous broadening greatly depend on the annealing time. We attribute the observations to nanoscale thermal processes occurring around single centers and leading to local strain fluctuations. Our experimental observation is supported by theoretical modeling based on first principles calculations. The results indicate that annealing is currently the main step limiting the scalable manufacturing of color centers in silicon.(c) 2023 Optica Publishing Group under the terms of the Optica Open Access Publishing Agreement
引用
收藏
页码:8352 / 8362
页数:11
相关论文
共 50 条
  • [31] RAPID THERMAL ANNEALING OF ARSENIC-IMPLANTED SILICON - A REVIEW
    FEYGENSON, A
    ZEMEL, JN
    THIN SOLID FILMS, 1988, 165 (01) : 109 - 138
  • [32] Epitaxial TiSi2 on silicon by rapid thermal annealing
    Wan, WK
    Wu, ST
    MATERIALS LETTERS, 1997, 30 (01) : 105 - 108
  • [33] SILICON RESISTOR TO MEASURE TEMPERATURE DURING RAPID THERMAL ANNEALING
    LIM, BS
    MA, E
    NICOLET, MA
    NATHAN, M
    REVIEW OF SCIENTIFIC INSTRUMENTS, 1988, 59 (01): : 182 - 183
  • [34] Rapid-Thermal Annealing of Amorphous Silicon on Oxide Semiconductors
    Saxena, Saurabh
    Jang, Jin
    IEICE TRANSACTIONS ON ELECTRONICS, 2010, E93C (10): : 1495 - 1498
  • [35] RAPID THERMAL ANNEALING OF ARSENIC AND BORON-IMPLANTED SILICON
    NARAYAN, J
    HOLLAND, OW
    EBY, RE
    WORTMAN, JJ
    OZGUZ, V
    ROZGONYI, GA
    APPLIED PHYSICS LETTERS, 1983, 43 (10) : 957 - 959
  • [36] FORMATION OF SILICIDES BY RAPID THERMAL ANNEALING OVER POLYCRYSTALLINE SILICON
    NARAYAN, J
    STEPHENSON, TA
    BRAT, T
    FATHY, D
    PENNYCOOK, SJ
    JOURNAL OF APPLIED PHYSICS, 1986, 60 (02) : 631 - 634
  • [37] SOLUBILITY ENHANCEMENT OF METALLIC IMPURITIES IN SILICON BY RAPID THERMAL ANNEALING
    MATHIOT, D
    BARBIER, D
    JOURNAL OF APPLIED PHYSICS, 1991, 69 (07) : 3878 - 3881
  • [38] FAST DIFFUSION OF AS IN POLYCRYSTALLINE SILICON DURING RAPID THERMAL ANNEALING
    WILSON, SR
    PAULSON, WM
    GREGORY, RB
    GRESSETT, JD
    HAMDI, AH
    MCDANIEL, FD
    APPLIED PHYSICS LETTERS, 1984, 45 (04) : 464 - 466
  • [39] Escape of phosphorus from silicon during rapid thermal annealing
    Sato, Y
    Yabumoto, N
    Imai, K
    PROCEEDINGS OF THE FOURTH INTERNATIONAL SYMPOSIUM ON PROCESS PHYSICS AND MODELING IN SEMICONDUCTOR TECHNOLOGY, 1996, 96 (04): : 164 - 171
  • [40] INTERSTITIAL CHROMIUM BEHAVIOR IN SILICON DURING RAPID THERMAL ANNEALING
    ZHU, J
    BARBIER, D
    MAYET, L
    GAVAND, M
    CHAUSSEMY, G
    APPLIED SURFACE SCIENCE, 1989, 36 (1-4) : 413 - 420