Preparation and characteristics of composite films with functionalized graphene/polyimide

Polyimide (PI) has the inherent defect of poor intrinsic thermal conductivity and cannot meet the increasing demand for rapid heat dissipation in the thermal management introduction. To improve the thermal conductivity of PI, in this study, thick sheet graphene-ionic liquid (TSG-IL) functionalized graphene has been prepared by a one-step ultrasonic-chemical method. Under the action of mechanical force, IL is successfully modified on the surface of TSG, and TSG is peeled to some extent. TSG-IL/PI has been prepared the typical method of solution casting followed by thermal imidization. The structure, morphology, thermal conductivity, and mechanical properties of the composites are evaluated by Fourier-transform infrared spectroscopy, x-ray diffraction analysis, scanning electron microscopy, transmission electron microscopy, and Hot Disk thermal conductivity tests. When the amount of TSG-IL is 0.3 wt%, the thermal conductivity of TSG-IL/PI (0.18 W center dot m-1 center dot k-1) than pure PI and TSG (ultrasonication)/PI increased by 50.0% and 28.6%, respectively. Moreover, it can maintain good mechanical properties, and its tensile strength (121.5 MPa) is 6.5% and 3.5% higher than that of pure PI and TSG (ultrasonication)/PI, respectively. The potential for application in the preparation of composites with high-thermal conductivity is promising. The experimental system is depicted in the ToC picture. First, we used a simple ultrasonic approach to create ionic liquid functionalized graphene (TSG-IL). Second, during the PI preparation, a small quantity of TSG-IL was added. Experimental results show that the thermal conductivity and mechanical characteristics of PI may be significantly enhanced at low additions of TSG-IL.image