A new type of low-stress flexible hinge displacement amplifying mechanism

被引:1
|
作者
Fan, Wei [1 ]
Zheng, Yingfang [1 ]
Ma, Ju [1 ]
机构
[1] Huaqiao Univ, Key Lab Proc Monitoring & Syst Optimizat Mech & El, Xiamen 361021, Peoples R China
基金
中国国家自然科学基金;
关键词
Flexible hinge; Differential leverage; Symmetrical cutting; Low stress; ANSYS finite element simulation;
D O I
10.1007/s40430-023-04342-3
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
A new type of low-stress flexible hinge displacement is designed to effectively improve the load capacity of flexible hinge position transfer large mechanisms and voltage ceramic output displacement. The principle of differential leverage amplification and the method of two-way symmetrical cutting of the flexible hinge of the mechanism design the second-level leverage transfer transmission mechanism. The cutting of the flexible hinge part is conducive to reducing the concentration of partial stress of the flexible hinge, thereby reducing the overall as a whole. The stress is required for deformation. It derived the agglomeration of the organization and simulated the stiffness and displacement of the mechanism through the ANSYS finite element software. The simulation results show that the institution can effectively amplify the input displacement of voltage ceramic. After being cut, the exerting position of the same load output end is 11.614 & mu;m. Compared with the output end displacement of 0.00517 & mu;m without cutting, it has been significantly improved 2243.7%.
引用
收藏
页数:11
相关论文
共 50 条
  • [31] Research on mechanism of crack initiation in low-stress cropping with radial breaking of small to medium diameter bars
    Xu, Jiayi
    Zhang, Lijun
    Sun, Xudong
    Zhou, Qiang
    Yang, Ning
    Zhongnan Daxue Xuebao (Ziran Kexue Ban)/Journal of Central South University (Science and Technology), 2022, 53 (02): : 482 - 490
  • [32] A new low-stress buck-boost converter for universal-input PFC applications
    Chen, JQ
    Maksimovic, D
    Erickson, R
    APEC 2001: SIXTEENTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, VOLS 1 AND 2, 2001, : 343 - 349
  • [33] A new motion mode of a parasitic motion principle (PMP) piezoelectric actuator by preloading the flexible hinge mechanism
    Yang, Zhixin
    Zhou, Xiaoqin
    Huang, Hu
    Dong, Jingshi
    Zhao, Hongwei
    SENSORS AND ACTUATORS A-PHYSICAL, 2019, 295 : 396 - 404
  • [34] Design, Analysis and Experimental Test of the Bridge-type Displacement Amplification Mechanism Based on the Topology Optimization of Flexure Hinge
    Lu Q.
    Kang S.
    Chen W.
    Wei H.
    Zhang Y.
    Luo L.
    Jixie Gongcheng Xuebao/Journal of Mechanical Engineering, 2022, 58 (11): : 57 - 71
  • [35] Efficacy of low-stress herding and low-moisture block to target cattle grazing locations on New Mexico rangelands
    Stephenson, Mitchell B.
    Bailey, Derek W.
    Howery, Larry D.
    Henderson, Leticia
    JOURNAL OF ARID ENVIRONMENTS, 2016, 130 : 84 - 93
  • [36] A New Type of Continuously Variable Displacement Mechanism Used for Hydraulic Motors
    李勇
    施光林
    陈兆能
    JournalofShanghaiJiaotongUniversity, 2007, (01) : 125 - 130
  • [37] New type of continuously variable displacement mechanism used for hydraulic motors
    Research Inst. of Mechatronics, Shanghai Jiaotong Univ., Shanghai 200030, China
    J. Shanghai Jiaotong Univ. Sci., 2007, 1 (125-130):
  • [38] Smooth, low-stress, sputtered tantalum and tantalum alloy films for the absorber material of reflective-type EUVL
    Takahashi, M
    Ogawa, T
    Hoko, H
    Hoshino, E
    Yamanashi, H
    Hirano, N
    Chiba, A
    Okazaki, S
    EMERGING LITHOGRAPHIC TECHNOLOGIES IV, 2000, 3997 : 484 - 495
  • [39] A new type of self-adaptive mechanism of amplifying force applied to prosthetic hand controlled by EMG
    Qinghua University, Beijing 100084, China
    CHIN. J. BIOMED. ENG., 2 (159-163):
  • [40] Optimal displacement amplification ratio of bridge-type compliant mechanism flexure hinge using the Taguchi method with grey relational analysis
    Ngoc-Thai Huynh
    Shyh-Chour Huang
    Thanh-Phong Dao
    Microsystem Technologies, 2021, 27 : 1251 - 1265