Comparison of Thermal Behaviour of Commercial Packages for Power Devices

被引：0
|
作者：
Giraudi, Lorenzo [1 ]
Tranchero, Maurizio [1 ]
Romano, Claudio [1 ]
Santero, Paolo [1 ]
机构：
[1] Ideas&Motion srl, Via Moglia 19, I-12062 Cherasco, CN, Italy
来源：
2023 29TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS, THERMINIC | 2023年
关键词：
power electronics; package; simulation;
D O I：
10.1109/THERMINIC60375.2023.10325905
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
This paper investigates the thermal performances of four different packages from two different suppliers, both topside and bottom side cooled using 3D CFD simulation. The results show the pros and cons of both solutions.
引用
收藏
页数：4
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