Thermal property of polyacrylate copolymers and their application in multilayer ceramic capacitor

Polyacrylate resin is commonly used as a thickener in organic vehicle for electronic slurry, and thermal decomposition of the resin is important for sintering of the electronic slurry. Polymethyl methacrylate-butyl methacrylate (PMMA-BMA) was prepared by free radical polymerization in this paper, the molecular structure of the copolymers was characterized by FTIR and H-1-NMR. The molar ratio of structure units and the yield were investigated. The effects of temperature, solvent/monomer ratio, initiator concentration and monomer ratio on the molecular weight and Mw/Mn of the copolymer resin were studied. The thermal decomposition of the polyacrylate resin was characterized with various monomer ratios, third monomers and chain transfer agents. The electronic slurry was prepared and sintered with the obtained polyacrylate resin as a thickener. The results showed that the molecular weight and Mw/Mn of the copolymer were influenced by polymerization conditions. The monomer content is closely related to the thermal decomposition and carbon residue of the resin. Addition of third monomer and chain transfer agent is an effective way to adjust the thermal decomposition of the resin. The electronic slurry with the obtained polyacrylate resin as a thickener, was sintered and showed excellent film compactness.