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- [1] Warpage of transfer-molded automotive power modules - experimental characterization, numerical simulation and optimization 2023 24TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS, EUROSIME, 2023,
- [2] High thermal dissipation transfer molded package for power modules 54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 1825 - 1830
- [3] Ultra-small compact transfer molded package for power modules 58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS, 2008, : 1832 - +
- [4] Reliability Modeling and Analysis of SiC MOSFET Power Modules IECON 2017 - 43RD ANNUAL CONFERENCE OF THE IEEE INDUSTRIAL ELECTRONICS SOCIETY, 2017, : 1459 - 1463
- [5] Reliability assessment of transfer molded CSP 2ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS, 1998, : 274 - 278
- [6] Reliability assessment of transfer molded CSP Proceedings of the Electronic Packaging Technology Conference, EPTC, 1998, : 274 - 278