Progress and prospect of diamond dynamic friction polishing technology

被引:6
|
作者
Yang, Tiancheng [1 ,2 ]
Song, Dunlan [1 ]
Hao, Zhaopeng [1 ]
机构
[1] Changchun Univ Technol, Sch Mech Engn, Changchun, Peoples R China
[2] Yanshan Univ, Sch Vehicle & Energy, Qinhuangdao, Peoples R China
关键词
Diamond; Dynamic friction polishing; Surface quality; Material removal rate; SINGLE-CRYSTAL DIAMOND; MATERIAL REMOVAL RATE; POLYCRYSTALLINE DIAMOND; TOOL WEAR; THIN-FILMS; PERFORMANCE; MECHANISM; ANISOTROPY; PREDICTION; OXIDATION;
D O I
10.1007/s00170-022-10463-1
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
Diamond is an important material in today and future industry, for its relatively advantages in hardness, optics, heat, and electricity. Strongly impeted by the synthetic low-cost and large-scale manufacturing feasibility, applications of diamond material quickly developed to optical windows, heat transfer, electronic semiconductors, and other high-tech fields, from the traditional field of cutting tools and jewelry. However, these applied fields require for superior surface quality, while great difficulties in the polishing and smooth processing are brought by the excellent physical and chemical characteristics of the diamond. In this paper, the research status of diamond mainstream polishing methods and dynamic friction polishing is summarized and analyzed, which proved that dynamic friction polishing is superior to other polishing methods in cost, efficiency, and precision. The progress of dynamic friction polishing technology was discussed from the aspects of equipment innovation, process parameter optimization, and material removal mechanism exploration. Dynamic friction polishing possesses vividly considerable application prospects, for its simple equipment, low cost of the processing, and can realize micro/nanoscale polishing at room temperature and no protective gas conditions. More strikingly, it can quickly reduce the surface roughness from microlevel to nanolevel.
引用
收藏
页码:1357 / 1378
页数:22
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