Assessment of cooling performance of mini/micro-channel stacked double layer heat sink

被引:3
|
作者
Ho, C. J. [1 ]
Peng, Jian-Kai [1 ]
Yang, Tien-Fu [2 ]
Rashidi, Saman [3 ]
Yan, Wei-Mon [4 ,5 ]
机构
[1] Natl Cheng Kung Univ, Dept Mech Engn, Tainan 70101, Taiwan
[2] Natl Chin Yi Univ Technol, Dept Refrigerat Air Conditioning & Energy Engn, Taichung 41170, Taiwan
[3] Semnan Univ, Fac New Sci & Technol, Dept Energy, Semnan, Iran
[4] Natl Taipei Univ Technol, Dept Energy & Refrigerating Air Conditioning Engn, Taipei 10608, Taiwan
[5] Natl Taipei Univ Technol, Res Ctr Energy Conservat New Generat Residential C, Taipei 10608, Taiwan
关键词
Double-layer heat sink; Cooling performance; Heat dissipation potential; Uniformity index; Thermal resistance; Energy efficiency; VISCOUS DISSIPATION; RAREFACTION;
D O I
10.1016/j.aej.2023.08.074
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A study is accomplished here to investigate the performance of a novel double-layer mini/micro-channel stacked heat sink (DL-MMCHSHS). The hydraulic diameter and aspect ratio of mini-channel heat sink are 0.12 cm and 3, respectively. The width of the fins between two channels is 0.04 cm. The total width of two runners is the same, and its width is 1.44 cm. The heat dissipation potential of this new type of heat sink is investigated. It was observed that the pressure loss is reduced by using the DL-MMCHSHS instead of a single-layer micro-channel heat sink (SL-MCHHS). The reduction in the pressure loss reduces the pumping power, which leads to decrease in operating costs of the system. For the total flow rate of 345.69 cm3/min, the pressure loss reduces about 35.41% by using the DL-MMCHSHS instead of a SL-MCHHS. The uniformity index in the range of 0.077 to 0.192 is achieved in this study. For the total flow rate of 346.64 cm3/min, the uniformity index enhances about 60% with boosting the flow rate ratio from 0.5 to 3.5. For the total flow rate of 1039.26 cm3/min, the thermal resistance increases about 76.22% as the flow rate ratio increases from 0.5 to 3.5.
引用
收藏
页码:465 / 474
页数:10
相关论文
共 50 条
  • [31] A Numerical Analysis of the Enhanced Performance in Heat Transfer of a Manifold Micro-Channel Heat Sink
    Tang W.
    Sun L.-C.
    Liu H.-T.
    Xie G.
    Tang J.-G.
    Bao J.-J.
    Dianzi Keji Daxue Xuebao/Journal of the University of Electronic Science and Technology of China, 2018, 47 (06): : 864 - 868
  • [32] A Study of the Heat Transfer Characteristics of the Micro-channel Heat Sink
    Wang, Shun
    Zhang, Yan
    Fu, Yifeng
    Liu, Johan
    Wang, Xiaojing
    Cheng, Zhaonian
    2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), 2009, : 179 - +
  • [33] Multiobjective Optimization of a Grooved Micro-Channel Heat Sink
    Ansari, Danish
    Husain, Afzal
    Kim, Kwang-Yong
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2010, 33 (04): : 767 - 776
  • [34] EXPERIMENTAL INVESTIGATION OF THE EFFECT OF FLOW ARRANGEMENTS ON THE PERFORMANCE OF A MICRO-CHANNEL HEAT SINK
    Sehgal, S. S.
    Murugesan, K.
    Mohapatra, S. K.
    EXPERIMENTAL HEAT TRANSFER, 2011, 24 (03) : 215 - 233
  • [35] Investigation of Hydrothermal Performance in Micro-Channel Heat Sink with Periodic Rectangular Fins
    Zhao, Heng
    Ma, Honghua
    Yan, Xiang
    Yu, Huaqing
    Xiao, Yongjun
    Xiao, Xiao
    Liu, Hui
    MICROMACHINES, 2023, 14 (10)
  • [36] Application of thermal resistance network model in optimization design of micro-channel cooling heat sink
    Shao, Baodong
    Wang, Lifeng
    Li, Jianyun
    Sun, Zhaowei
    INTERNATIONAL JOURNAL OF NUMERICAL METHODS FOR HEAT & FLUID FLOW, 2009, 19 (3-4) : 535 - 545
  • [37] Modelling of a micro-channel heat sink for cooling of high-power laser diode arrays
    Furmanski, Piotr
    Thualfaqir, Kadhim
    Lapka, Piotr
    ARCHIVES OF THERMODYNAMICS, 2018, 39 (03) : 15 - 27
  • [38] Heat Transfer Performance of Lotus-type Porous Copper Micro-channel Heat Sink
    Chen, Haifeng
    Liu, Yuan
    Chen, Liutao
    Li, Yanxiang
    MATERIALS PERFORMANCE, MODELING AND SIMULATION, 2013, 749 : 414 - 420
  • [39] Optimization and comparison of double-layer and double-side micro-channel heat sinks with nanofluid for power electronics cooling
    Sakanova, Assel
    Yin, Shan
    Zhao, Jiyun
    Wu, J. M.
    Leong, K. C.
    APPLIED THERMAL ENGINEERING, 2014, 65 (1-2) : 124 - 134
  • [40] Combined micro-channel heat sink optimization for cooled electronics
    Bello-Ochende, Tunde
    Meyer, Josua P.
    PROCEEDINGS OF THE ASME/JSME THERMAL ENGINEERING SUMMER HEAT TRANSFER CONFERENCE 2007, VOL 2, 2007, : 661 - 669