Oxidized film on Cp/Cu-Cd electrical contact material

被引：1
|
作者：
邵文柱 [1 ]
甄良 [1 ]
李义春 [2 ]
崔玉胜 [1 ]
周劲松 [1 ]
机构：
[1] School of Materials Science and Technology, Harbin Institute of Technology, Harbin 150001, China  2. Department of Materials Science and Engineering, Tsinghua University, Beijing 100084, China
来源：
Transactions of Nonferrous Metals Society of China | 2005年 / S2期
关键词：
Cu-based composites; electrical contact materials; XPS; oxidation;
D O I：
暂无
中图分类号：
TG174.4 [金属表面防护技术];
学科分类号：
080503 ;
摘要：
Constituents of the oxidized surface film on diamond particles reinforced Cu-Cd alloy matrix composite （Cp/Cu-Cd） were investigated by XPS. The results show that Cu2O is the main constituent when the oxidized film is thin; CuO appears only after the film is rather thick. The originally formed oxidized film on the Cp/Cu-Cd is about 10nm in thickness and is mainly composed of Cu2O and Cu. After oxidized at 120℃ over 30h, CuO is detected in the film.
引用
收藏
页码：251 / 255
页数：5
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