Edge termination study and fabrication of a 4H-SiC junction barrier Schottky diode

被引:0
|
作者
陈丰平 [1 ]
张玉明 [1 ]
张义门 [1 ]
汤晓燕 [1 ]
王悦湖 [1 ]
陈文豪 [2 ]
机构
[1] School of Microelectronics,Key Laboratory of Wide Band-Gap Semiconductor Materials and Devices,Xidian University
[2] School of Technical Physics,Xidian University
基金
中国国家自然科学基金;
关键词
4H-SiC; junction barrier Schottky; offset field plate; electrical characteristics;
D O I
暂无
中图分类号
TN311.7 [];
学科分类号
0805 ; 080501 ; 080502 ; 080903 ;
摘要
The 4H-SiC junction barrier Schottky(JBS) diodes terminated by field guard rings and offset field plate are designed,fabricated and characterized.It is shown experimentally that a 3-μm P-type implantation window spacing gives an optimum trade-off between forward drop voltage and leakage current density for these diodes,yielding a specific on-resistance of 8.3 mΩ·cm~2.A JBS diode with a turn-on voltage of 0.65 V and a reverse current density less than 1 A/cm~2 under 500 V is fabricated,and the reverse recovery time is tested to be 80 ns,and the peak reverse current is 28.1 mA.Temperature-dependent characteristics are also studied in a temperature range of 75°C-200°C.The diode shows a stable Schottky barrier height of up to 200°C and a stable operation under a continuous forward current of 100 A/cm~2.
引用
收藏
页码:446 / 450
页数:5
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