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- [42] Temperature and Oxygen Partial Pressure Dependences of the Surface Tension of Liquid Sn–Ag and Sn–Cu Lead-free Solder Alloys Monatshefte für Chemie / Chemical Monthly, 2005, 136 : 1829 - 1834
- [43] ELECTROMOTIVE FORCE MEASUREMENTS OF FREE ENERGY OF FORMATION OF MOLTEN LEADCHLORIDE JOURNAL OF CHEMICAL AND ENGINEERING DATA, 1966, 11 (04): : 596 - &
- [45] Lead-Free Copper Alloys for Bearing Applications TRANSACTIONS OF THE AMERICAN FOUNDRY SOCIETY, VOL 119, 2011, 119 : 239 - +
- [46] An overview and comparison of viable lead-free alloys 2001 HD INTERNATIONAL CONFERENCE ON HIGH-DENSITY INTERCONNECT AND SYSTEMS PACKAGING, PROCEEDINGS, 2001, 4428 : 308 - 313
- [47] Machinability Enhancement of Lead-Free Brass Alloys 6TH CIRP INTERNATIONAL CONFERENCE ON HIGH PERFORMANCE CUTTING (HPC2014), 2014, 14 : 95 - 100
- [49] Interfacial reaction between multicomponent lead-free solders and Ag, Cu, Ni, and Pd substrates Journal of Electronic Materials, 2004, 33 : 1080 - 1091
- [50] The current status of lead-free solder alloys IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2001, 24 (04): : 244 - 248