Study on High-power LED Heat Dissipation Based on Printed Circuit Board

被引：2
|
作者：
WANG Yiwei1
2.Tianjin Gongda HiYu Solid State Lighting Co
机构：
来源：
Semiconductor Photonics and Technology | 2010年 / 16(Z1)卷 / Z1期
关键词：
high-power LED; printed circuit board(PCB); substrate of heat dissipation; thermal resistance; junction temperature;
D O I：
暂无
中图分类号：
TN41 [印刷电路];
学科分类号：
摘要：
In order to study the role of printed circuit board(PCB)in high-power LED heat dissipation,a simple model of high-power LED lamp was designed.According to this lamp model,some thermal performances such as thermal resistances of four types of PCB and the changes of LED junction temperature were tested under three different working currents.The obtained results indicate that LED junction temperature can not be lowered significantly with the decreasing thermal resistance of PCB.However,PCB with low thermal resistance can be matched with smaller volume heat sink,so it is hopeful to reduce the size,weight and cost of LED lamp.
引用
收藏
页码：120 / 124
页数：5
相关论文
共 50 条
  • [41] Computing method of thermal conductivity of heat dissipation vias in printed circuit board and its optimization
    Xiao, Shuo
    Zhao, Yang
    Cao, Yuan
    Jiang, Haifeng
    Zhu, Wenliang
    CIRCUIT WORLD, 2015, 41 (01) : 14 - 19
  • [42] Thermal dissipation behavior outward the epoxy mold of high-power LED
    Bang, Young-Tae
    Kim, Byung-Ho
    Kim, Dong-Hwan
    Bae, Byung-Kyu
    Park, Kyung-Min
    Bin, Jin-Hyuck
    Im, Eun-Ji
    Lim, Ye-Seul
    Lee, Mi-Ran
    Son, Mi-Rang
    Moon, Cheol-Hee
    IDW'11: PROCEEDINGS OF THE 18TH INTERNATIONAL DISPLAY WORKSHOPS, VOLS 1-3, 2011, : 1389 - 1392
  • [43] Power Loss and Heat Dissipation Characteristics of High-Power Electromechanical Actuators
    Li Peng
    Gao Zhi-gang
    Zhou Jun
    4TH INTERNATIONAL CONFERENCE ON MECHATRONICS AND MECHANICAL ENGINEERING (ICMME 2017), 2018, 153
  • [44] Design of High-power LED Drive Circuit with Economical High Power Factor based on NCP1200
    Wang, Longteng
    Jin, Yonggao
    MECHATRONICS ENGINEERING, COMPUTING AND INFORMATION TECHNOLOGY, 2014, 556-562 : 1806 - 1810
  • [45] Analysis of heat dissipation for Integrated High Power LED Lamp
    Jiang, Lanfang
    Liu, Hong
    OPTICAL DESIGN AND TESTING IV, 2010, 7849
  • [46] Research on Heat Dissipation Technology of the High-Power Array Antenna
    Ge, Jiawei
    Jin, Dayuan
    Qian, Zhiwei
    PROCEEDINGS OF THE SEVENTH ASIA INTERNATIONAL SYMPOSIUM ON MECHATRONICS, VOL II, 2020, 589 : 400 - 412
  • [47] Study on the Heat Disspation System Using Thermoelectric Cooling Based on Energy Harvesting for High-power LED
    Wang, Ning
    Gao, Cong
    Lu, Qiuling
    Jia, Hongzhi
    Sui, Guorong
    Gao, Xiumin
    2019 CROSS STRAIT QUAD-REGIONAL RADIO SCIENCE AND WIRELESS TECHNOLOGY CONFERENCE (CSQRWC), 2019,
  • [48] Fabrication of alumina/copper heat dissipation substrates by freeze tape casting and melt infiltration for high-power LED
    Tang, Yufei
    Qiu, Sha
    Li, Miaomiao
    Zhao, Kang
    JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 690 : 469 - 477
  • [49] Comparison and optimization of single-phase liquid cooling devices for the heat dissipation of high-power LED arrays
    Ramos-Alvarado, Bladimir
    Feng, Bo
    Peterson, G. P.
    APPLIED THERMAL ENGINEERING, 2013, 59 (1-2) : 648 - 659
  • [50] Comparative Study of Printed Circuit Board Substrates used for Thermal Management of High Power LEDs
    Freisleben, Jaroslav
    Dzugan, Tomas
    Hamacek, Ales
    2015 38TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE 2015), 2015, : 80 - 84
12345