Damage mechanisms during lapping and mechanical polishing CdZnTe wafers

被引：0
|
作者：
LI Yan
机构：
来源：
Rare Metals | 2010年 / 29卷 / 03期
基金：
中国国家自然科学基金;
关键词：
lapping; mechanical polishing; wafers; surface; subsurface; abrasive;
D O I：
暂无
中图分类号：
TG580.692 [抛光];
学科分类号：
摘要：
CdZnTe wafers were machined by lapping and mechanical polishing processes,and their surface and subsurface damages were investigated.The surface damages are mainly induced by three-body abrasive wear and embedded abrasive wear during lapping process.A new damage type,which is induced by the indentation of embedded abrasives,is found in the subsurface.When a floss pad is used to replace the lapping plate during machining,the surface damage is mainly induced by two-body abrasive and three-body abrasive wear,and the effect of embedded abrasives on the surface is greatly weakened.Moreover,this new damage type nearly disappears on the subsurface.
引用
收藏
页码：276 / 279
页数：4
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