Diffusion bonding of γ-TiAl alloy to Ti-6Al-4V alloy under hot pressure

被引：0
|
作者：
王秀锋
马蓦
刘学斌
吴学庆
檀朝桂
石荣凯
林建国
机构：
[1] China
[2] Faculty of Material & Photoelectronic Physics Xiangtan University
[3] Key Laboratory of Low Dimensional Materials and Application Technology of Ministry of Education
[4] Xiangtan 411105
来源：
Transactions of Nonferrous Metals Society of China | 2006年 / 05期
基金：
中国国家自然科学基金;
关键词：
γ-TiAl alloys; Ti-6Al-4V alloys; diffusion bonding; microstructure;
D O I：
暂无
中图分类号：
TG457 [各种金属材料和构件的焊接];
学科分类号：
摘要：
The diffusion bonding of γ-TiAl alloy to Ti-6Al-4V alloy at different temperatures ranging from 1 073 to 1 173 K under an applied stress of 100 MPa for 2 h was studied. The observation of the microstructure reveals that sound joints between the γ-TiAl alloy and the Ti-alloy without any pores or cracks can be achieved through diffusion bonding at temperatures over 1 073 K under the applied stress of 100 MPa for 2 h. The bond is composed of two zones, and its width increases with the increase of bonding temperature. The EDS chemical composition profiles indicate that there is a diffusion flux of Al atoms from γ-TiAl alloy towards the Ti alloy and of Ti atoms in the opposite direction. The three point-bending of the joints bonded under different conditions was tested and the fracture mode was analyzed by SEM observation.
引用
收藏
页码：1059 / 1063
页数：5
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