Finite Element Analysis on Thermal Stress of SEN

被引:0
|
作者
WANG Jianzhu [1 ]
ZHAO Junxue [1 ,2 ]
机构
[1] School of Metallurgical Engineering,Xi'an University of Architecture and Technology
[2] State Key Laboratory of New Technology of Iron and Steel Metallurgy,University of Science and Technology Beijing
关键词
submerged entry nozzle; thermal stress; finite element method; tapered zone;
D O I
暂无
中图分类号
TF777 [连续铸钢、近终形铸造];
学科分类号
080602 ;
摘要
Thermal stress of SEN was studied by using finit element analysis( FEA). The results disclose:( 1) fo the tapered zone of SEN,the thermal stress reaches it peak after casting for about 30 s,at this moment,th axial stress is the largest,the circumferential stress come the second and the radial stress is the smallest;( 2)when SEN suffers the thermal stress,the inner wall suf fers the pressure stress,and the shorter the distance from the inner wall is,the larger the pressure stress is; th outer wall suffers the tensile stress and the shorter the dis tance from the outer wall is,the larger the tensile stres is; the axial stress holds a dominant position in the ta pered zone,while the circumferential stress takes the lead in the cylindrical zone;( 3) as angle α of SEN’s taper ed zone increases, the thermal stress grows obviousl when α is larger than 110°; while the thermal stress re duces obviously,when α is larger than 140°; thus,fo SEN design,it is essential to avoid the interval of α =110°- 140°.
引用
收藏
页码:51 / 54
页数:4
相关论文
共 50 条
  • [41] FINITE ELEMENT STRESS ANALYSIS.
    Anon
    Automotive Engineering International, 1977, 85 (04): : 44 - 48
  • [42] Finite element planar stress analysis
    Ayari, ML
    Zhang, PX
    Ye, ZM
    INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 1996, 33 (29) : 4365 - 4378
  • [43] A finite element study of thermal stress in copper interconnect
    Su, P
    Rzepka, S
    Korhonen, MA
    Li, CY
    STRESS INDUCED PHENOMENA IN METALLIZATION, 1999, 491 : 298 - 303
  • [45] Finite element analysis on thermal stress for Al/Ti composite coatings on uranium substrate
    Dong Ping
    Li Ruiwen
    Jiang Fan
    Chen Piheng
    RARE METAL MATERIALS AND ENGINEERING, 2006, 35 (06) : 885 - 889
  • [46] Finite-Element Analysis of Current-Induced Thermal Stress in a Conducting Sphere
    Liu, Ming
    Yang, Fuqian
    JOURNAL OF ELECTRONIC MATERIALS, 2012, 41 (02) : 352 - 361
  • [47] Finite element thermal stress analysis of solid oxide fuel cell cathode microstructures
    Vaidya, Sushrut
    Kim, Jeong-Ho
    JOURNAL OF POWER SOURCES, 2013, 225 : 269 - 276
  • [48] Thermal-stress Finite Element Analysis of Different Bonding Wire Shapes of IGBT
    Wang, Qi
    An, Tong
    Qin, Fei
    Gong, Yanpeng
    Dai, Yanwei
    Chen, Pei
    2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2022,
  • [49] THERMAL-STRESS ANALYSIS DUE TO WELDING PROCESSES BY THE FINITE-ELEMENT METHOD
    CHIDIAC, SE
    MIRZA, FA
    COMPUTERS & STRUCTURES, 1993, 46 (03) : 407 - 412
  • [50] Viscoelastic Finite Element Stress Analysis of the Thermal Compatibility of Dental Bilayer Ceramic Systems
    DeHoff, Paul H.
    Anusavice, Kenneth J.
    INTERNATIONAL JOURNAL OF PROSTHODONTICS, 2009, 22 (01) : 56 - 61