DIFFUSION BONDING OF TiAl TO Ti AND TC4 ALLOY

被引：1
|
作者：
P. He
J. H. Zhang
J. C. Feng and Y. Y. Qian (National Key Laboratory of Advanced Welding Production Technology
机构：
来源：
ActaMetallurgicaSinica(EnglishLetters) | 2000年 / 01期
关键词：
diffusion bonding; interface reacting; TiAl;
D O I：
暂无
中图分类号：
TG146.2 [轻有色金属及其合金];
学科分类号：
摘要：
TiAl was diffusion bonded to Ti and TC4 alloy in vacuum furnace. Results showed,at the TiAl-Ti interface,the reaction layer of stratification Ti3Al was formed closest to TiAl base,and the a phase and the α + βphase arised closest to Ti base at 1173K and 1573K respectively. The phase structure of TiAl/ and the phase structure of TiAlwere observed be- tween AiAl and TC4 under respetive bonding temperature.The fiacture at tensile testing occurred in the bond - line, producing very flat fracture surfaces with some pull-out of the TiAl materials.The ultimate tensile strengths of the joint were approximate to γ-TiAl base marterial.
引用
收藏
页码：162 / 167
页数：6
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