Guest editorial: 24th international conference on electronic packaging technology

被引：0

|

作者：

Zhang, Shuye ^{[1
]}

Wang, Qidong ^{[2
]}

Huang, Mingliang ^{[3
]}

Paik, Kyung W. ^{[4
]}

机构：

[1] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin, Peoples R China

[2] Chinese Acad Sci, Inst Microelect, Beijing, Peoples R China

[3] Dalian Univ Technol, Sch Mat Sci & Engn, Dalian, Peoples R China

[4] Korea Adv Inst Sci & Technol, Dept Mat Sci & Engn, Seoul, South Korea

来源：

SOLDERING & SURFACE MOUNT TECHNOLOGY | 2025年 / 37卷 / 02期

关键词：

D O I：

10.1108/SSMT-03-2025-080

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

收藏

页码：85 / 85

页数：1

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