Process Simulation of Gold Wire Ball Thermosonic Bonding for Hybrid Integrated Circuits

被引：0
|
作者：
Dong, Yue [1 ]
Zhang, Jun [1 ]
Ma, Qiang [1 ]
Yan, Xu [1 ]
Zhang, Pei [1 ]
Yang, Liu [1 ]
机构：
[1] China Aerosp Sci & Technol Corp, Inst 771, Xian, Peoples R China
来源：
2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT | 2022年
关键词：
gold wire ball bonding; process parameters; Ansys simulation;
D O I：
10.1109/ICEPT56209.2022.9873380
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Gold wire ball thermosonic bonding process is a key process of internal interconnection of hybrid integrated circuits, which plays a decisive role in the performance and reliability of products. This paper simulates the gold wire ball thermosonic bonding process based on ANSYS LS-DYNA simulation software, and analyzes the energy transfer of transducer rod and the effects of process parameters on gold wire ball and pad in the process of gold wire ball thermosonic bonding. At the same time, for some problems in the application of gold wire ball bonding technology in engineering, the reasons are analyzed by simulation, which provides a scientific method for subsequent process optimization.
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页数：6
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