Investigation of embedded microchannel heat transfer performance based on high power integrated chip<bold> </bold>

The high-power integrated chips face severe thermal management problems, and the embedded microchannel cooling method is an effective heat dissipation technique for high density integrated chips. This paper analyzes the influence of heat transfer performance of microchannel structural parameters in chips. The microchannel structural parameters are optimized by comprehensive performance evaluation factors and finally the optimal heat transfer performance is obtained. The results show that the pressure drop increases as the microchannel heat transfer performance increases. Comprehensive evaluation showed that the side length, height and spacing of square fins with 0.3mm, 0.18mm and 1.2mm, respectively, had a better overall performance evaluation factor.<bold> </bold>