THERMAL PERFORMANCES OF ASINUSOIDAL PIN FIN: AN ANALYTICALSOLUTION

被引:0
|
作者
El Moutaouakil, L. [1 ]
机构
[1] Cadi Ayyad Univ, Fac Sci Semlalia, Dept Phys, Fluid Mech & Energet Lab, BP 2390, Marrakech, Morocco
来源
HIGH TEMPERATURE MATERIAL PROCESSES | 2025年 / 29卷 / 01期
关键词
extraction mode; injection mode; heat generation; sinusoidal; convection; radiation; analytical; temperature dependent properties; efficiency; effectiveness; ADOMIAN DECOMPOSITION METHOD; HEAT-TRANSFER; POROUS FINS; TEMPERATURE; CONDUCTIVITY; CONVERGENCE;
D O I
10.1615/HighTempMatProc.2024054101
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this paper, the Adomian decomposition method is applied to determine the efficiency and the ef-fectiveness of a heat-generating sinusoidal pin fin, involving convective and radiative heat transferswith different environments. The developed analytical solution takes into account the fact that sev-eral characteristics of sinusoidal pin fin are temperature-dependent. The parameters considered tobe temperature-dependent are the thermal conductivity, the convective heat transfer coefficient, theemissivity, and the heat generation rate. To check the applicability of the analytical method, a numer-ical solution is carried out using the finite volume approach. Results from Adomian decompositionmethod were used to investigate the effect of various parameters on the thermal performances of thesinusoidal pin fin. These results show a good agreement with numerical data. In addition, sinusoidalpin fins are found to perform better than the conventional pin fins with uniform cross section
引用
收藏
页码:15 / 32
页数:18
相关论文
共 50 条
  • [41] Thermal optimization of the pin-fin heat sink with variable fin density cooled by natural convection
    Lee, Young Jin
    Kim, Sung Jin
    APPLIED THERMAL ENGINEERING, 2021, 190
  • [42] Heat transfer and pressure loss performances for additively manufactured pin fin arrays in annular channels
    Lorenzon, Andrea
    Vaglio, Emanuele
    Casarsa, Luca
    Sortino, Marco
    Totis, Giovanni
    Sarago, Giuseppe
    Lendormy, Eric
    Raukola, Juho
    APPLIED THERMAL ENGINEERING, 2022, 202
  • [43] Experimental parametric study of a deep groove within a pin fin arrays regarding fin thermal resistance
    Al-Karagoly, Mohammed Khalaf Ulaiwi
    Ayani, Mohammad-bagher
    Mamourian, Mojtaba
    Bazaz, Sajad Razavi
    INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, 2020, 115
  • [44] Investigation on the thermal and hydrodynamic performances of a micro-pin fin array heat sink for cooling a multi-chip printed circuit board
    Wang, Zuyuan
    Zheng, Shichen
    Xu, Shanglong
    Dai, Yalong
    APPLIED THERMAL ENGINEERING, 2024, 239
  • [45] Thermal performances of Gyroid-fin heat sink for power chips
    Chen, Mingyi
    Shi, Yusheng
    Yang, Lei
    Yan, Chunze
    Song, Bo
    Liu, Yongjiang
    Dou, Zechun
    Chen, Yanping
    CASE STUDIES IN THERMAL ENGINEERING, 2024, 61
  • [46] Comparison of thermal performance between plate-fin and pin-fin heat sinks in natural convection
    Joo, Younghwan
    Kim, Sung Jin
    INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2015, 83 : 345 - 356
  • [47] Effect of fin shape on the thermal performance of nanofluid-cooled micro pin-fin heat sinks
    Ambreen, Tehmina
    Kim, Man-Hoe
    INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2018, 126 : 245 - 256
  • [48] Impingement thermal performance of perforated circular pin-fin heat sinks
    Wen, Mao-Yu
    Yeh, Cheng-Hsiung
    HEAT AND MASS TRANSFER, 2018, 54 (04) : 1009 - 1020
  • [49] Experimental thermal characterization of pin fin heat sinks with top and side bypass
    Lei, Ning
    Ortega, Alfonso
    ADVANCES IN ELECTRONIC PACKAGING 2005, PTS A-C, 2005, : 291 - 298
  • [50] Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications
    Arif, A. F. M.
    Zubair, Syed M.
    Pashah, S.
    JOURNAL OF ELECTRONIC PACKAGING, 2012, 134 (04)