Optimization of read operation for low power consumption in 3D NAND flash memory

被引:0
|
作者
Park, Jesun [1 ]
Kim, Seongwoo [1 ]
Cho, Taeyoung [3 ]
Kang, Myounggon [1 ,2 ]
机构
[1] Univ Seoul, Dept Intelligent Semicond Engn, Seoul 02504, South Korea
[2] Univ Seoul, Sch Adv Fus Studies, Seoul 02504, South Korea
[3] Korea Natl Univ Transportat, Dept Elect Engn, Room 326,Smart ICT Bldg,50 Daehak Ro, Chungju Si 27469, Chungbuk, South Korea
关键词
3D NAND flash memory; Channel potential; Read disturbance; Hot carrier injection (HCI); Channel boosting; SUPPRESSION;
D O I
10.1016/j.mee.2025.112324
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This study proposes a low power read operation to minimize the hot carrier injection (HCI) phenomenon that occurs during read operations in 3D NAND Flash Memory. Owing to the characteristics of the 3D NAND Flash Memory structure, the channels of unselected strings can easily remain in a floating state. This leads to HCI during read operations, resulting in read disturbances. To improve the read disturb characteristics, triangular pulse voltages (VTP) with adjusted slopes and delayed application times were applied to the string selected line (SSL) and the ground selected line (GSL) during read operations. Using the proposed read scheme, it was confirmed that HCI was decreased compared to the conventional method, and it was possible to operate at low power.
引用
收藏
页数:5
相关论文
共 50 条
  • [21] Low Power Program Scheme With Capacitance-Less Charge Recycling for 3D NAND Flash Memory
    Huang, Cece
    Liu, Fei
    Wang, Qianqian
    Huo, Zongliang
    IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, 2021, 68 (07) : 2478 - 2482
  • [22] CDS: Coupled Data Storage to Enhance Read Performance of 3D TLC NAND Flash Memory
    Wu, Wan-Ling
    Hsieh, Jen-Wei
    Ku, Hao-Yu
    IEEE TRANSACTIONS ON COMPUTERS, 2024, 73 (03) : 694 - 707
  • [23] A Review of Program disturb of 3D NAND Flash Memory
    Lou, Bojie
    Liu, Qihao
    Zeng, Zhaogui
    Zhou, Yongwang
    Zhong, Ji
    2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
  • [24] Trends and Future Challenges of 3D NAND Flash Memory
    Shim, Sun Il
    Jang, Jaehoon
    Song, Jaihyuk
    2023 IEEE INTERNATIONAL MEMORY WORKSHOP, IMW, 2023, : 9 - 12
  • [25] Improvement of warpage and leakage for 3D NAND flash memory
    Zhang, Kun
    Zhou, Wenxi
    Li, Tuo
    Wang, Sicong
    Cheng, Xiaomin
    Xia, Zhiliang
    Miao, Xiangshui
    MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2024, 176
  • [26] Analysis of HBM Failure in 3D NAND Flash Memory
    Song, Biruo
    Li, Zhiguo
    Wang, Xin
    Fu, Xiang
    Liu, Fei
    Jin, Lei
    Huo, Zongliang
    ELECTRONICS, 2022, 11 (06)
  • [27] Study on cell shape in 3D NAND flash memory
    Feng, Wei
    Deng, Ning
    PROCEEDINGS OF THE 2015 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2015, : 387 - 390
  • [28] Read Disturb and Reliability: The Complete Story for 3D CT NAND Flash
    Ren, Tianyu
    Li, Qiao
    Ye, Min
    Xue, Chun Jason
    2023 IEEE 12TH NON-VOLATILE MEMORY SYSTEMS AND APPLICATIONS SYMPOSIUM, NVMSA, 2023, : 1 - 6
  • [29] Asymmetric Read Bias for Alleviating Cell- to-Cell Interference in 3D NAND Flash Memory
    Sim, Jae-Min
    Song, Yun-Heub
    2021 IEEE REGION 10 SYMPOSIUM (TENSYMP), 2021,
  • [30] RBER Aware Multi-Sensing for Improving Read Performance of 3D MLC NAND Flash Memory
    Zhang, Meng
    Wu, Fei
    Chen, Xubin
    Du, Yajuan
    Liu, Weihua
    Zhao, Yahui
    Wan, Jiguang
    Xie, Changsheng
    IEEE ACCESS, 2018, 6 : 61934 - 61947