Influence of alloying elements on bonding interface of palladium-plated copper wire in humid and high temperature environment

被引：0
|
作者：
Wen, Xiaodong [1 ]
Yang, Donghua [2 ]
Hu, Kailun [1 ]
Li, Tao [1 ]
Xia, Daquan [3 ]
Wang, Zhenhua [1 ]
Zhang, Chunhong [1 ]
机构：
[1] Chongqing Univ Technol, Coll Mat Sci & Engn, Chongqing, Peoples R China
[2] Chongqing Univ Technol, Chongqing Municipal Engn Res Ctr, Inst Higher Educ Special Welding Mat & Technol, Chongqing, Peoples R China
[3] Chongqing Pingwei Enterprise Co Ltd, Chongqing, Peoples R China
来源：
2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT | 2024年
关键词：
palladium plated copper wire; trace alloying elements; corrosion resistance; automotive electronics;
D O I：
10.1109/ICEPT63120.2024.10668658
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In this paper, a new type of palladium plated copper wire (PW-B) is designed and developed independently. This kind of copper wire is to prevent halide corrosion by regulating the trace alloying elements in the copper substrate and adjusting the intermetallic compounds formed at the welding interface with the aluminum pad, so as to improve the reliability of the product. In this paper, high accelerated stress reliability test is carried out to verify the reliability of the material under high temperature and high humidity environment. The results show that PW-B has good reliability in the extreme environment of high temperature, high humidity and halide action, and is expected to be applied in automotive electronics in the future.
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页数：3
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