Understanding on the Correlation between Mechanical Properties and Thermal Conductivity of Hot-Forged Copper/Diamond Composites

被引：0
|
作者：
Jia, Shanquan [1 ]
Ma, Jingnan [1 ]
Bolzoni, Leandro [1 ]
Yang, Fei [1 ]
机构：
[1] Univ Waikato, Waikato Ctr Adv Mat & Mfg, Sch Engn, Hamilton 3240, New Zealand
来源：
ADVANCED ENGINEERING MATERIALS | 2024年
关键词：
copper diamond composites; interfacial bonding; mechanical property; DIAMOND PARTICLES; COATED-DIAMOND; INTERFACE CHARACTERISTICS; CU/DIAMOND COMPOSITES; CU; CONDUCTANCE; INTERLAYER; POWDER; MATRIX;
D O I：
10.1002/adem.202401909
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Evaluation of the mechanical properties of copper/diamond composites is necessary for understanding the interfacial bonding, which is important for the interface thermal conductance and thermal conductivity of the composites. The tensile and three-point bending tests are conducted on the hot-forged copper/diamond composites using Cr powder additives and Cr-coated diamond. The interfacial bonding strength of the composites is calculated and evaluated based on the tensile results. The fracture mechanisms of the fabricated copper/diamond composites are discussed and compared. The highest tensile strength (69 MPa) and interface bonding strength (0.043 J m-2) are achieved for the Cu-3Cr-55vol% diamond composite hot-forged under 1050 degrees C. The connection between the composite's interfacial bonding strength and its thermal conductivity is elaborated.
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页数：10
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