A review of the electric measurements and their failure criteria for solder joint degradation

The assessment of solder joint quality and reliability in electronic devices has an important role in many dustries and guarantees challenges for reliability engineers. This article explores various methods for the electrical measurement of solder joints, focusing on resistance measurement, impedance measurement, and thermal resistance measurement. Based on the presented articles, impedance measurement emerges as the most effective method, although its complexity can limit its profitability. Resistance measurement, while approaching the curacy of impedance measurement, is more widely used due to its simplicity. Thermal resistance measurement, although complicated, provides less precise results compared to the other methods. Various standards define failure based on similar criteria, with IPC-9701B offering the latest and best-defined criteria for data logger measurements. It is suggested that future literature adopt this evaluation method to enhance the comparability different measurement results for solder joint failure. The relationship between crack length and electrical properties is crucial for detecting and predicting potential failures in solder joints. Establishing a clear connection between crack length and electrical properties can lead to more rational failure criteria, reducing the likelihood of overdesigning solder joints.