SiC-substrate Uni-traveling-carrier Photodiode Modules for 300-GHz-band Wireless Communications

被引：0
|
作者：
Nagatsuma, Tadao [1 ,2 ]
Ohara, Takahiro [1 ]
Kawamoto, Yuma [1 ]
Maekawa, Keisuke [1 ]
Ishibashi, Tadao [3 ]
机构：
[1] Osaka Univ, Grad Sch Engn Sci, Toyonaka, Osaka, Japan
[2] Univ Tokyo, Grad Sch Sci, Tokyo, Japan
[3] Wavepackets LLC, Atsugi, Kanagawa, Japan
来源：
2024 49TH INTERNATIONAL CONFERENCE ON INFRARED, MILLIMETER, AND TERAHERTZ WAVES, IRMMW-THZ 2024 | 2024年
关键词：
photodiode; SiC; wireless communication; dielectric waveguide;
D O I：
10.1109/IRMMW-THz60956.2024.10697890
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper presents an efficient integration of SiC-substrate uni-traveling-carrier photodiodes (UTC-PDs) with Si dielectric waveguides for broadband high-power transmitters in the 300-GHz band, and demonstrates the first successful experiment of wireless communications at data rates of over 200 Gbit/s.
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页数：2
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