Interfacial reaction of Cu/SnPbInBiSb/Cu sandwich solder joints

被引：3
|
作者：
Wang, Shuai [1 ]
Feng, Jiayun [1 ]
Sa, Zicheng [1 ]
Wang, Yiping [1 ]
Wang, Shang [1 ]
Tian, Yanhong [1 ]
机构：
[1] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Peoples R China
来源：
2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT | 2022年
基金：
国家重点研发计划;
关键词：
High entropy alloy; Diffusion behavior; Solder joint; Microstructure evolution; CHALLENGES;
D O I：
10.1109/ICEPT56209.2022.9873169
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The high quality of 3D integrated circuit technology is in need of solder alloy with high reliability. To optimize the performance of solder alloys, the conception of high entropy alloy is introduced into the design of solder alloy. In this study, a new-style high entropy alloy SnPbInBiSb was prepared and investigated. This high entropy alloy has a wetting angle about 39.8 degrees and a melting temperature around 112.8 degrees C, thus it has a great potential to work as a new kind of low-temperature high entropy solder alloy. The interfacial reaction behavior of Cu/SnPbInBiSb/Cu sandwich joints was also investigated. The intermetallic compound Cu6Sn5 was transformed into Cu-6(Sn, Pb, In, Bi, Sb)(5) with the diffusion of Pb, In, Bi and Sb atoms. Moreover, the growth behavior of intermetallic compound was effectively restrained due to the effect of high entropy solder alloy.
引用
收藏
页数：5
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