Heat dissipation optimization study of LTCC-based RF SiP components

In order to improve the low temperature co-fired ceramic (LTCC) as the substrate of RF components in the work of high temperature problem, this paper aims to modify the internal structure and materials of T/R components, with the goal of improving the high-temperature working environment of T/R component chips. By doing so, it hopes to modify the heat transfer path of chips and the thermal conductivity of LTCC substrates, which will improve the heat dissipation performance of LTCC RF System-in-Package (SiP) components. Simulation is carried out using ICEPAK finite element software to simulate the model with increasing heat transfer path and increasing thermal conductivity of the structure. It is found that increasing the heat transfer path can effectively reduce the temperature of the TR component chip during operation, and the heat dissipation effect is improved less after further improving the thermal conductivity of the structure.