Design of T/R Module Based on SIP

被引：0
|
作者：
Kang Kai [1 ]
Li Baoxin [1 ]
Yan Shaomin [1 ]
机构：
[1] Xian Res Inst Nav Technol, Xian 710071, Peoples R China
来源：
2024 INTERNATIONAL CONFERENCE ON MICROWAVE AND MILLIMETER WAVE TECHNOLOGY, ICMMT | 2024年
关键词：
SIP; T/R module; Phased array radar;
D O I：
10.1109/ICMMT61774.2024.10671849
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
SIP technology has the characteristics of small module size, high reliability and high production efficiency. The assembly process of T/R module based on SIP modules is simple and easy to achieve rapid automated production, which effectively reducing the cost of T/R module. In this paper, A miniaturized and high performance X-band T/R module has been developed based on two SIP modules, which is applied in active phased array radar equipment.
引用
收藏
页数：3
相关论文
共 50 条
  • [41] Design of SIP-based IMPP client
    Park, SO
    Hyun, W
    Huh, MY
    Han, JC
    Kang, SG
    6TH INTERNATIONAL CONFERENCE ON ADVANCED COMMUNICATION TECHNOLOGY, VOLS 1 AND 2, PROCEEDINGS: BROADBAND CONVERGENCE NETWORK INFRASTRUCTURE, 2004, : 741 - 744
  • [42] Design and implementation of SIP-based AOCE
    Deng Zhenrong
    Huang Wenming
    Tang Zhenbo
    2009 2ND IEEE INTERNATIONAL CONFERENCE ON COMPUTER SCIENCE AND INFORMATION TECHNOLOGY, VOL 5, 2009, : 81 - +
  • [43] Design of a Ka-Band Heterogeneous Integrated T/R Module of Phased Array Antenna
    Zeng, Qinghua
    Chen, Zhengtian
    He, Mengyun
    Wang, Song
    Liu, Xiao
    Xu, Haitao
    ELECTRONICS, 2024, 13 (01)
  • [44] Design of vertical transition for broad-band T/R module applications with LTCC technology
    Shen Ya
    Zhou Jun
    2007 1ST ASIAN AND PACIFIC CONFERENCE ON SYNTHETIC APERTURE RADAR PROCEEDINGS, 2007, : 148 - 150
  • [45] The design of T/R module for X-band APAA system used in satellite communications
    Jung, YB
    Eom, SY
    Jeon, SI
    Choi, JI
    Park, HK
    2002 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3, 2002, : 1337 - 1340
  • [46] Research on the welding technology of T/R components assembled with SIP moulds
    Liu, Zhidan
    Zhao, Zhiping
    Zhang, Fei
    Chen, Shuai
    2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
  • [47] Highly Integrated and Solderless LTCC Based C-Band T/R Module
    Giordani, Roberto
    Amici, Marco
    Barigelli, Alessandro
    Conti, Franco
    Del Marro, Marco
    Feudale, Marziale
    Imparato, Massimiliano
    Suriani, Andrea
    2009 EUROPEAN MICROWAVE CONFERENCE, VOLS 1-3, 2009, : 1760 - 1763
  • [48] Highly Integrated and Solderless LTCC Based C-Band T/R Module
    Giordani, Roberto
    Amici, Marco
    Barigelli, Alessandro
    Conti, Franco
    Del Marro, Marco
    Feudale, Marziale
    Imparato, Massimiliano
    Suriani, Andrea
    2009 EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE (EUMIC 2009), 2009, : 407 - 410
  • [49] A Key Lifetime Parameters Extraction Method for T/R Module Based on Association Rule
    Hou, Xiaodong
    Yang, Jiangping
    Deng, Bin
    Xia, Liang
    Zhang, Yu
    Zhang, Ze
    2018 INTERNATIONAL CONFERENCE ON SENSING, DIAGNOSTICS, PROGNOSTICS, AND CONTROL (SDPC), 2018, : 165 - 170
  • [50] LTCC Technology Based Ultra Light and Ultra Small Volume T/R Module
    Zhang, Zhigang
    Sun, Jiawen
    Zhu, Weifeng
    Zhang, Shu
    2019 INTERNATIONAL CONFERENCE ON MICROWAVE AND MILLIMETER WAVE TECHNOLOGY (ICMMT 2019), 2019,
12345