Solid-State Bonding with SAC305 Sheets for Direct Cooling

被引：0
|
作者：
Jo, Eunjin [1 ,2 ]
Kim, YehRi [1 ,3 ]
Park, Young-Bae [2 ]
Kim, Dongjin [1 ]
机构：
[1] Korea Institute Of Industrial Technology (KITECH), Micro-Joining Center, Incheon, Korea, Republic of
[2] School Of Materials Science And Engineering, Andong National University, Andong, Korea, Republic of
[3] School Of Electrical Engineering, Graduate School, Korea University, Seoul, Korea, Republic of
来源：
2024 International Conference on Electronics Packaging, ICEP 2024 | 2024年
关键词：
Compilation and indexing terms; Copyright 2025 Elsevier Inc;
D O I：
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中图分类号：
学科分类号：
摘要：
Diffusion bonding - Electronics packaging - Wafer bonding
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页码：147 / 148
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