High-Temperature-Resistant Polyimide Films With Enhanced Tg for Improved Performance in Flexible TFT Devices

被引:0
|
作者
He, Dan [1 ]
Chen, Teng [2 ]
Guo, Yuanzheng [2 ]
Li, Guanglan [1 ]
Liu, Xi [1 ]
Li, Chuanyong [2 ]
Yu, Yong [2 ]
Lan, Chuanyan [2 ]
机构
[1] Chongqing College of Humanities Science and Technology, Chongqing, China
[2] BOE Technology Group Co., Ltd, Beijing, China
来源
Journal of Applied Polymer Science | 1600年 / John Wiley and Sons Inc卷
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