Machine learning potential for the Cu-W system

被引:0
|
作者
Liyanage, Manura [1 ,2 ]
Turlo, Vladyslav [1 ,2 ]
Curtin, W. A. [3 ,4 ]
机构
[1] Empa Swiss Fed Labs Mat Sci & Technol, Lab Adv Mat Proc, CH-3602 Thun, Switzerland
[2] Empa, Natl Ctr Computat Design & Discovery Novel Mat MAR, CH-3602 Thun, Switzerland
[3] Ecole Polytech Fed Lausanne, Natl Ctr Computat Design & Discovery Novel Mat MAR, CH-1015 Lausanne, Switzerland
[4] Brown Univ, Sch Engn, Providence, RI 02906 USA
来源
PHYSICAL REVIEW MATERIALS | 2024年 / 8卷 / 11期
基金
瑞士国家科学基金会;
关键词
METAL-MATRIX COMPOSITES; MOLECULAR-DYNAMICS; EPITAXIAL-GROWTH; MECHANICAL-PROPERTIES; 110; SURFACE; BEHAVIOR; MULTILAYERS; COPPER; MICROSTRUCTURE; DISLOCATIONS;
D O I
10.1103/PhysRevMaterials.8.113804
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Combining the excellent thermal and electrical properties of Cu with the high abrasion resistance and thermal stability of W, Cu-W nanoparticle-reinforced metal matrix composites and nano-multilayers are finding applications as brazing fillers and shielding material for plasma and radiation. Due to the large lattice mismatch between fcc Cu and bcc W, these systems have complex interfaces that are beyond the scales suitable for ab initio methods, thus motivating the development of chemically accurate interatomic potentials. Here, a neural network potential (NNP) for Cu-W is developed within the Behler-Parrinello framework using a curated training dataset that captures metallurgically relevant local atomic environments. The Cu-W NNP accurately predicts (i) the metallurgical properties (elasticity, stacking faults, dislocations, thermodynamic behavior) in elemental Cu and W, (ii) energies and structures of Cu-W intermetallics and solid solutions, and (iii) a range of fcc Cu/bcc W interfaces, and exhibits physically reasonable behavior for solid W/liquid Cu systems. As will be demonstrated in forthcoming work, this near ab initio accurate NNP can be applied to understand complex phenomena involving interface-driven processes and properties in Cu-W composites.
引用
收藏
页数:21
相关论文
共 50 条
  • [21] Cu-W Thin Film Electrodeposited in an Aqueous Solution
    Saitou, M.
    INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE, 2017, 12 (06): : 4714 - 4723
  • [22] Interface-driven solid-state alloying in an immiscible Cu-W system
    Chen, YG
    Liu, BX
    JOURNAL OF PHYSICS D-APPLIED PHYSICS, 1997, 30 (12) : 1729 - 1733
  • [23] Microstructure and characteristics of Cu-W composite prepared by W-coated Cu powder with different W contents
    Li, Xiuqing
    Wang, Qi
    Wei, Shizhong
    Lou, Wenpeng
    Xu, Liujie
    Zhou, Yucheng
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2024, 892
  • [24] Microcosmic Simulation and Analysis for Infiltration Procedure of Cu-W Alloy
    Zhang Wei
    Zou Juntao
    Bai Yanxia
    RARE METAL MATERIALS AND ENGINEERING, 2012, 41 (10) : 1746 - 1750
  • [25] Thermal, electrical and wear behavior of sintered Cu-W nanocomposite
    Selvakumar, N.
    Vettivel, S. C.
    MATERIALS & DESIGN, 2013, 46 : 16 - 25
  • [26] Microcosmic simulation and analysis for infiltration procedure of Cu-W alloy
    Zou, J. (zoujt077@163.com), 1746, Science Press (41):
  • [27] Dynamic energy absorption of Cu-W interpenetrating phase composites
    Hu, M.
    Lian, X. H.
    Li, S. J.
    Liu, Z. Q.
    Wang, Y. M.
    Tang, E. L.
    Peng, H.
    Hou, J. H.
    Yang, G. Y.
    Wang, J.
    Yang, R.
    JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2025, 35 : 1703 - 1711
  • [28] Preparation of Cu-W film by ion beam sputtering and characterization
    Ai, Yong-ping
    CHEMICAL PHYSICS LETTERS, 2017, 690 : 1 - 4
  • [29] A new Cu-W bionic shell pearl multilayer structure
    Wang, Bobo
    Zhu, Jiajun
    Xie, Tianle
    Fu, Licai
    Yang, Wulin
    Li, Deyi
    Zhou, Lingping
    SURFACE & COATINGS TECHNOLOGY, 2023, 461
  • [30] The research of integral Cu-W electric contact by friction welding
    Song, Hua
    Fu, Lihua
    Duan, Peilin
    Sun, Zaibin
    PROGRESSES IN FRACTURE AND STRENGTH OF MATERIALS AND STRUCTURES, 1-4, 2007, 353-358 : 1911 - +