Development of Next-Generation Distortion Correction Technologies for High-Precision Wafer-to-Wafer Bonding

被引：0
|
作者：
Mitsuishi, Hajime [1 ]
Mori, Hiroshi [1 ]
Maeda, Hidehiro [1 ]
Ushijima, Mikio [1 ]
Kamashita, Atsushi [1 ]
Okada, Masashi [1 ]
Aramata, Masanori [1 ]
Shiomi, Takashi [1 ]
Sakamoto, Shinya [1 ]
Takahata, Kishou [1 ]
Chiba, Tomohiro [1 ]
Fukuda, Minoru [1 ]
Kanbayashi, Masahiro [1 ]
Shimoda, Toshimasa [1 ]
Sugaya, Isao [1 ]
机构：
[1] Nikon Corporation, Kanagawa,244-8533, Japan
来源：
2024 International Conference on Electronics Packaging, ICEP 2024 | 2024年
关键词：
Compilation and indexing terms; Copyright 2025 Elsevier Inc;
D O I：
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学科分类号：
摘要：
Bonding - Electronics packaging - Wafer bonding
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