Research and Optimization of Composition and Processing Parameters of Tantalum Crystal Wafer CMP Polishing Slurry

被引：0
|
作者：
Bai, Xiyu [1 ]
Li, Weiwei [1 ]
Zhong, Rongfeng [2 ]
Xiao, Yinbo [2 ]
Wang, Xiaojian [1 ]
Xu, Ninghui [1 ]
机构：
[1] College of Electronic Information Engineering, Hebei University of Technology, Tianjin,300401, China
[2] Guangdong Wellt-Nanotech Co., Ltd., Guangdong, Dongguan,523000, China
来源：
Surface Technology | 2024年 / 53卷 / 24期
关键词：
D O I：
10.16490/j.cnki.issn.1001-3660.2024.24.012
中图分类号：
学科分类号：
摘要：
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页码：133 / 143
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