Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder Alloys

被引：0
|
作者：
Zhou, Jiye [1 ]
Tan, Xin F. [1 ,2 ]
McDonald, Stuart D. [1 ]
Sweatman, Keith [1 ,3 ]
Akaiwa, Tetsuya [3 ]
Nogita, Kazuhiro [1 ]
机构：
[1] School Of Mechanical And Mining Engineering, The University Of Queensland, Australia
[2] Kyushu University, Department Of Applied Quantum Physics And Nuclear Engineering, Japan
[3] Nihon Superior Co., Ltd., Japan
来源：
2024 International Conference on Electronics Packaging, ICEP 2024 | 2024年
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摘要：
Thermal expansion
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页码：81 / 82
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