Electron-microscopic investigation of elastic deformations near grain boundaries in ultrafine-grained copper

被引:0
|
作者
Islamgaliev, R.K. [1 ]
Valiev, R.Z. [1 ]
机构
[1] Ufa State Technical Univ of Aviation, Ufa, Russia
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [41] Effect of Grain Boundaries on Fracture Toughness in Ultrafine-Grained Metals by Atomic-scale Computational Experiments
    Shimokawa, Tomotsugu
    Tanaka, Masaki
    Higashida, Kenji
    THERMEC 2011, PTS 1-4, 2012, 706-709 : 1841 - +
  • [42] Mössbauer Emission Spectroscopy of Grain Boundaries in Ultrafine-Grained Niobium Obtained by Severe Plastic Deformation
    V. V. Popov
    E. V. Osinnikov
    R. M. Falakhutdinov
    Physics of Metals and Metallography, 2022, 123 : 825 - 830
  • [43] Emission Mossbauer spectroscopy of grain boundaries in ultrafine-grained W and Mo produced by severe plastic deformation
    Popov, V. V.
    Sergeev, A. V.
    Stolbovsky, A. V.
    PHYSICS OF METALS AND METALLOGRAPHY, 2017, 118 (04): : 354 - 361
  • [44] STRESS-DRIVEN ROTATIONS OF DEFORMATION-DISTORTED GRAIN BOUNDARIES IN NANOCRYSTALLINE AND ULTRAFINE-GRAINED MATERIALS
    Bobylev, S. V.
    Ovid'ko, I. A.
    REVIEWS ON ADVANCED MATERIALS SCIENCE, 2015, 41 (1-2) : 20 - 34
  • [45] Simultaneous Grain Growth and Grain Refinement in Bulk Ultrafine-Grained Copper under Tensile Deformation at Room Temperature
    Hailiang Yu
    Cheng Lu
    Anh Kiet Tieu
    Huijun Li
    Ajit Godbole
    Charlie Kong
    Xing Zhao
    Metallurgical and Materials Transactions A, 2016, 47 : 3785 - 3789
  • [46] Simultaneous Grain Growth and Grain Refinement in Bulk Ultrafine-Grained Copper under Tensile Deformation at Room Temperature
    Yu, Hailiang
    Lu, Cheng
    Tieu, Anh Kiet
    Li, Huijun
    Godbole, Ajit
    Kong, Charlie
    Zhao, Xing
    METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2016, 47A (08): : 3785 - 3789
  • [47] Study of Thermal Stability of Ultrafine-Grained Copper by means of Electron Back Scattering Diffraction
    Man, Ondrej
    Pantelejev, Libor
    Kunz, Ludvik
    MATERIALS TRANSACTIONS, 2010, 51 (02) : 209 - 213
  • [48] Grain Size Variation during Low Temperature Creep and Tensile Deformation of Ultrafine-Grained Copper
    Okubo, Satoshi
    Miyajima, Yoji
    Fujii, Toshiyuki
    Onaka, Susumu
    Kato, Masaharu
    MATERIALS TRANSACTIONS, 2013, 54 (09) : 1605 - 1611
  • [49] ELECTRON-MICROSCOPIC STUDY OF GRAIN-BOUNDARIES IN CONDENSED FILMS OF METALS
    IEVLEV, VM
    IZVESTIYA AKADEMII NAUK SSSR SERIYA FIZICHESKAYA, 1977, 41 (05): : 999 - 1003
  • [50] Grain growth mechanisms in ultrafine-grained steel: an electron backscatter diffraction and in situ TEM study
    Ahmels, Laura
    Kashiwar, Ankush
    Scherer, Torsten
    Kuebel, Christian
    Bruder, Enrico
    JOURNAL OF MATERIALS SCIENCE, 2019, 54 (14) : 10489 - 10505