Failure Prediction at High-speed Wire Drawing.

A mathematical model is suggested for high-speed wire drawing. The viscoplastic model circuit determines velocities and stress with regard to inertial members and tape by angle of the drawing die. The problem on temperature field distribution in the focus is solved by taking into account surface and volume heat due to surface friction of the wire against the die and viscoplastic deformation of the product. On the basis of solutions obtained the critical velocities of drawing are determined which correspond to viscous and brittle failure.