HYBRID ICs MAKE THE MOST OF LIMITED SPACE.

被引：0

作者：

Sanders, Henk

机构：

来源：

JEE. Journal of electronic engineering | 1987年 / 24卷 / 250期

关键词：

CERAMIC MATERIALS - ELECTRONICS PACKAGING - INTEGRATED CIRCUITS; THICK FILM - INTEGRATED CIRCUITS; THIN FILM - SUBSTRATES;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Less bulky than discrete components, less expensive than monolithic ICs, hybrid ICs have the flexibility of discretes and the reliability of monolithics. The article briefly outlines thin- and thick-film hybrid IC technology and presents two thin-film hybrid IC's that are small enough to mount transversely in proximity detectors having coils 20 mm in diameter. The chips produce a proximity detection operating distance of between 2 and 5mm, depending on the coil.

引用

页码：38 / 39

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