共 50 条
- [46] Microstructural evolution of a lead-free solder alloy Sn-Bi-Ag-Cu prepared by mechanical alloying during thermal shock and aging Journal of Electronic Materials, 2000, 29 : 1021 - 1026
- [47] Effect of annealing on microstructure and mechanical properties of bulk nanocrystalline Fe3Al alloy with 5 wt.% Cu prepared by aluminothermic reaction MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2011, 528 (24): : 7140 - 7148