ENCAPSULATED CHIP PACKAGED ON TAPE.

被引：0
|
作者：
Marshall, James [1 ]
Hullmann, Jack [1 ]
机构：
[1] Mesa Technology, Mountain View, CA,, USA, Mesa Technology, Mountain View, CA, USA
来源：
Semiconductor International | 1985年 / 8卷 / 08期
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页码：170 / 173
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